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 MT9D112: 1/4-Inch 2Mp SOC Digital Image Sensor Features
www..com
1/4-Inch 2Mp System-On-A-Chip (SOC) CMOS Digital Image Sensor
MT9D112
For the latest data sheet, refer to Aptina's Web site: www.aptina.com
Features
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Table 1:
Optical format Full resolution Pixel size Chief ray angle
Key Performance Parameters
Value 1/4-inch (4:3) 1600 x 1200 pixels (UXGA) 2.2 x 2.2m 22.1 deg maximum at 75% image height 27.0 deg maximum at 80% image height RGB Bayer pattern 3.56mm x 2.68mm Electronic rolling shutter (ERS) with global reset 6-54 MHz 15 fps at full resolution, 24 fps in preview mode, 30 fps in video mode 80 Mb/s 6 MHz to 80 MHz 2.5-3.1V 1.7-1.95V 1.7-1.95V or 2.5-3.1V 2.5-3.1V 1.7-3.1V 10-bit, on-die 0.53 V/lux-sec (preliminary) 59.5dB (preliminary) 37.7dB (preliminary) 245mW at 15 fps, full resolution 230mW at 30 fps, video mode 168mW at 24 fps, preview mode 10W, standby/shutdown -30C to +70C (at junction) Bare die
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DigitalClarity(R) CMOS imaging technology Superior low-light performance Ultra-low-power, low-cost Internal master clock generated by on-chip phaselocked loop (PLL) oscillator Electronic rolling shutter (ERS), progressive scan Integrated image flow processor (IFP) for single-die camera module Automatic image correction and enhancement, including 4-channel lens shading correction with independent corner correction Arbitrary image scaling with anti-aliasing Integrated microcontroller for flexibility Two-wire serial interface providing access to registers and microcontroller memory Selectable output data format: YCbCr, 565RGB, 555RGB, 444RGB, processed Bayer, RAW8, and RAW10 bit Output FIFO for data rate equalization Programmable I/O slew rate Parallel and serial MIPI data output Xenon and LED flash support with fast exposure adaptation Flexible support for external auto focus, optical zoom, and mechanical shutter Independently configurable gamma correction
Parameter
Color filter array Active pixel array area Shutter type Input clock frequency Maximum frame rate
Maximum data rate/ master clock Analog Digital Supply voltage I/O PLL AF ADC resolution Responsivity Dynamic range SNRMAX Power consumption Operating temperature Packaging
Applications
* Cellular phones * PC cameras * PDAs
Ordering Information
Table 2: Available Part Numbers
Part Number MT9D112D00STCK15AC1 MT9D112D00STCZK15AC1 Description Bare die (22.1 deg CRA) Bare die (27.0 deg CRA)
PDF: 2042175286/Source:6345780379 MT9D11_DS - Rev. K 5/10 EN
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Aptina reserves the right to change products or specifications without notice. (c)2005 Aptina Imaging Corporation All rights reserved.
Products and specifications discussed herein are subject to change by Aptina without notice.
MT9D112: 1/4-Inch 2Mp SOC Digital Image Sensor Table of Contents
www..com
Table of Contents
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 MT9D112 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 Signal Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Typical Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 Architecture Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 Sensor Core Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 Pixel Array . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Pixel Array Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Default Readout Order . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 Analog Processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 Analog Readout Channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 Timing and Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 Gain Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 Integration Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 PLL-Generated Master Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 PLL Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 Readout Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 Window Size . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 Readout Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 Horizontal Mirror . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 Vertical Flip. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 Column and Row Skip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 Programming Restrictions when Skipping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 Binning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 Binning Limitations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 Raw Data Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 Raw Data Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 SOC Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 Image Flow Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 Test Patterns . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 First Black Level Subtraction and Digital Gain . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26 Lens Shading Correction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26 Lens Correction Zones . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26 Defect Correction and Noise Reduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 Color Interpolation and Edge Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 Second Black Level Correction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28 Color Correction and Aperture Correction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28 Image Cropping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28 Contrast and Gamma Correction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28 S-Curve . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29 RGB to YUV Conversion. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 Color Kill . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 YUV Color Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 Image Scaling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31 YUV-to-RGB/YUV Conversion and Output Formatting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31 Color Conversion Formulas . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31 Y'U'V' . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
PDF: 2042175286/Source: 6345780379 MT9D112_DS - Rev. L 5/10 EN Aptina reserves the right to change products or specifications without notice. (c)2005 Aptina Imaging Corporation. All rights reserved.
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MT9D112: 1/4-Inch 2Mp SOC Digital Image Sensor Table of Contents
www..com
Y'U'V' Using sRGB Formulas . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32 Output Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32 Parallel and MIPI Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32 Output Format and Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32 YUV/RGB Uncompressed Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32 Uncompressed YUV/RGB Data Ordering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 FIFO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 Watermark . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 Camera Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36 General Purpose I/Os . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36 Output Enable Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36 Trigger Control. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36 Streaming/Standby Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37 Firmware Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37 Sequencer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37 Context and Operational Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38 Preview Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38 Still Capture and Video Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38 Snapshot and Flash. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38 Video . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38 Auto Exposure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39 Preview Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39 Evaluative Algorithm (MDR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40 Accelerated Settling During Overexposure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40 Exposure Control. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40 AE MDR Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41 Auto White Balance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42 Flicker Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42 Auto Focus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43 Algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43 Modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44 Lens Actuator Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44 Two-Wire Serial Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46 Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46 Start Condition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46 Stop Condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46 Data Transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46 Slave Address/Data Direction Byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46 Message Byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47 Acknowledge Bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47 No-Acknowledge Bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47 Typical Serial Transfer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47 Single Read from Random Location. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48 Single Read from Current Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48 Sequential Read, Start from Random Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49 Sequential Read, Start from Current Location. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49 Single Write to Random Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50 Sequential Write, Start at Random Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50 Registers and Variables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51 How to Access Registers and Variables. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51 Variables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51 Special Function Registers and MCU SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52
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Core Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53 Double-buffered Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53 Bad Frames . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53 Changes to Integration Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53 Changes to Gain Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54 Timing Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55 Power-up Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55 Hard Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56 Soft Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56 Standby Sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57 Hard Standby . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57 Soft Standby (Two-wire Serial Interface) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58 How to Inhibit Standby Entry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59 How to Synchronize Standby with End of Frame . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59 How to Reproduce the Sequence of Soft Standby in DevWare . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60 Pin States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .62 Spectral Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .63 Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65 Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .70
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List of Figures
Figure 1: Figure 2: Figure 3: Figure 4: Figure 5: Figure 6: Figure 7: Figure 8: Figure 9: Figure 10: Figure 11: Figure 12: Figure 13: Figure 14: Figure 15: Figure 16: Figure 17: Figure 18: Figure 19: Figure 20: Figure 21: Figure 22: Figure 23: Figure 24: Figure 25: Figure 26: Figure 27: Figure 28: Figure 29: Figure 30: Figure 31: Figure 32: Figure 33: Figure 34: Figure 35: Figure 36: Figure 37: Figure 38: Figure 39: Figure 40: Figure 41: Figure 42: Figure 43: Typical Configuration (connections) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 SOC Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 Sensor Core Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Pixel Array. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Pixel Color Pattern Detail (Top Right Corner) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 Imaging a Scene . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 6 Pixels in Normal and Column Mirror Readout Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 6 Rows in Normal and Row Mirror Readout Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 8 Pixels in Normal and Column Skip 2X Readout Modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 Pixel Readout (no skipping) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 Pixel Readout (x_odd_inc=3, y_odd_inc=1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 Pixel Readout (x_odd_inc=1, y_odd_inc=3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 Pixel Readout (x_odd_inc=3, y_odd_inc=3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 Pixel Readout (x_odd_inc=3, y_odd_inc=1, x_bin=1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 Pixel Readout (x_odd_inc=3, y_odd_inc=3, x_ybin=1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 Pixel Data Timing Example. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 Pixel Data Timing Example. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 Row Timing and FRAME_VALID/LINE_VALID Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 Color Pipeline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 Test Patterns . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 Lens Correction Zones. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 Gamma Correction Curve. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29 Contrast "S" Curve . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 Timing of Uncompressed Full Frame Output or Decimated Output Passing Through the FIFO . . .33 Example of Timing for Non-Decimated Uncompressed Output Bypassing Output FIFO . . . . . . . . .34 Software Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37 Gain vs. Exposure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41 Single Read from Random Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48 Single Read from Current Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48 Sequential Read, Start from Random Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49 Sequential Read, Start from Current Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49 Single Write to Random Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50 Sequential Write, Start at Random Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50 Internal Power-On Reset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55 Hard Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56 Hard Standby. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57 Soft Standby . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58 Chief Ray Angle (CRA 22.1 Deg) vs. Image Height . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .63 Chief Ray Angle (27.0 Deg CRA ) vs. Image Height . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64 Quantum Efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64 I/O Timing Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65 Two-Wire Serial Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .68 Two-Wire Serial Interface Start and Stop Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .68
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MT9D112: 1/4-Inch 2Mp SOC Digital Image Sensor List of Tables
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List of Tables
Table 1: Table 2: Table 3: Table 4: Table 5: Table 6: Table 7: Table 8: Table 9: Table 10: Table 11: Table 12: Table 13: Table 14: Table 15: Table 16: Table 17: Table 18: Table 19: Table 20: Table 21: Table 22: Table 23: Table 24: Table 25: Key Performance Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Available Part Numbers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Frequency Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 Row Address Sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 Row Timing Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 Gamma Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29 Contrast Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 YCrCb Output Data Ordering. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 RGB Ordering in Default Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 2-Byte RGB Format. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 Output Enable Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36 Trigger Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36 Streaming/STANDBY. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37 POR Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55 Hard Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56 Hard Standby. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57 Soft Standby . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58 Summary of Standby States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60 Pin States During Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .62 AC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .66 I/O Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .67 DC Electrical Definitions and Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .67 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .68 Two-Wire Serial Interface Timing Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .69
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MT9D112: 1/4-Inch 2Mp SOC Digital Image Sensor General Description
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General Description
The Aptina(R) MT9D112 is a 1/4-inch 2Mp CMOS image sensor with an integrated advanced camera system. This camera system features a microcontroller (MCU), a sophisticated image flow processor (IFP), and both parallel and serial mobile industry processor interface (MIPI) interfaces. It also includes a programmable general purpose I/O module (GPIO), which can be used to control external auto focus (AF), optical zoom, or mechanical shutter. The microcontroller manages all components of the camera system and sets key operation parameters for the sensor core to optimize the quality of raw image data entering the IFP. The sensor core consists of an active pixel array of 1616 x 1216 pixels, programmable timing and control circuitry including a PLL and external flash support, analog signal chain with automatic offset correction and programmable gain, and two 10-bit analog-to-digital converters (ADC). The entire system-on-a-chip (SOC) has ultra-low power requirements and superior low light performance that is particularly suitable for mobile applications. The MT9D112 is based on DigitalClarity(R) Technology--Aptina's breakthrough low-noise CMOS imaging technology that achieves near-CCD image quality (based on signal-to-noise ratio and lowlight sensitivity) while maintaining the inherent size, cost, power consumption, and integration advantages of CMOS.
MT9D112 Overview
The MT9D112 has a color image sensor with a Bayer color filter arrangement and a 2Mp active-pixel array with electronic rolling shutter and global reset. The sensor core readout is 10-bit and supports skipping, binning and can be flipped and/or mirrored. The sensor core also supports separate analog and digital gain for all four color channels (R, Gr, Gb, B). The MT9D112 also has an embedded phase-locked loop oscillator (PLL) that can generate the internal sensor clock from the common wireless system clock. When in use, the PLL adjusts the incoming clock frequency up, allowing the MT9D112 to run at almost any desired resolution and frame rate within the sensor's capabilities. The PLL can be bypassed and powered down to reduce power consumption. Low power consumption is a very important requirement for all components of wireless devices. The MT9D112 has numerous power-conserving features, including soft and hard standby modes, as well as an external SHUTDOWN pin that allows the internal power bus to be disabled. Another important consideration for wireless devices is their electromagnetic interface (EMI). The MT9D112 can be used with either a serial MIPI interface or the parallel data output interface which has a programmable I/O slew rate to minimize EMI and an output FIFO to eliminate output data bursts. The advanced image flow processor and flexible programmability of the MT9D112 provide a variety of ways to enhance and optimize the image sensor performance. Built-in optimization algorithms enable the MT9D112 to operate at factory settings as a fully automatic, highly adaptable camera; however, most of its settings are user-programmable. These algorithms include black level conditioning, lens shading correction, defect correction, noise reduction, color interpolation, edge detection, color correction, aperture correction, and image formatting such as cropping and scaling.
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MT9D112: 1/4-Inch 2Mp SOC Digital Image Sensor MT9D112 Overview
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The MT9D112 also includes a sequencer that coordinates all events triggered by the user. The sequencer manages auto focus, auto white balance, flicker detection, and auto exposure for the different operating modes which include preview, still capture, video, and snapshot with flash. A two-wire serial register interface bus enables read/write access to control registers, variables, and special function registers within the MT9D112. The hardware registers are grouped internally by pages and include sensor core controls, color pipeline controls, and output controls. Variables are located in the microcontroller's RAM memory and are used for drivers such as the auto exposure (AE), auto white balance (AWB), and auto focus (AF). Special function registers are registers connected to the local bus of the microcontroller and include GPIO and the waveform generator. The general purpose I/O can be configured to allow the user to output a flash or shutter pulse or to achieve 10-bit parallel output, or they can be configured as inputs to enable the user to use features such as an external trigger.
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MT9D112: 1/4-Inch 2Mp SOC Digital Image Sensor Signal Description
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Signal Description
Table 3 provides the signal descriptions for the MT9D112.
Table 3:
Name
Signal Description
Type Input Input Input Input Input Input Input I/O I/O I/O Output Output Output Output Output Output Output Output Supply Supply Supply Supply Supply Supply Supply Supply Supply Supply Description Power down VDD, active HIGH. Reserved for factory test. Tie to digital ground during normal operation (can leave floating if not used). Controls sensor standby mode, active HIGH. Two-wire serial interface clock. Selects device address for the two-wire serial interface. The address is 0x78 when SADDR is tied LOW, 0x7A if tied HIGH. Master reset signal, active LOW. Input clock signal 6-54 MHz. General purpose digital I/O, could be configured for FLASH/SHUTTER/DOUT_LSB0/DOUT_LSB1/ MODULE_ID/OE_BAR/TRIGGER. Two-wire serial interface data. General purpose digital I/O. Used for auto focus function (can leave floating if not used). Eight-bit image data output or most significant bits (MSB) of 10-bit sensor bypass mode. Differential MIPI data (sub-LVDS, negative) (must leave floating if not used). Differential MIPI data (sub-LVDS, positive) (must leave floating if not used). Differential MIPI clock (sub-LVDS, negative) (must leave floating if not used). Differential MIPI clock (sub-LVDS, positive) (must leave floating if not used). Pixel clock. Used for sampling DOUT, FRAME_VALID, and LINE_VALID. Identifies lines in the active image. Identifies rows in the active image. Digital power (1.8V). Pixel array power (2.8V). Analog power (2.8V). PLL power (2.8V). I/O power supply (1.7-1.95V or 2.5-3.1V). I/O ground. Digital, I/O, and PLL ground. Analog ground. I/O power supply for GPIO_AF[7:0] pads (can leave floating if not used). IO ground for GPIO_AF[7:0].
SHUTDOWN TEST_EN STANDBY SCLK SADDR RESET_BAR EXTCLK GPIO[3:0] SDATA GPIO_AF[7:0] DOUT[7:0] DATA_OUT_N DATA_OUT_P CLK_OUT_N CLK_OUT_P PIXCLK LINE_VALID FRAME_VALID VDD VAA_PIX VAA VDD_PLL VDD_IO GND_IO DGND AGND VDD_AF GND_AF
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MT9D112: 1/4-Inch 2Mp SOC Digital Image Sensor Typical Connections
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Typical Connections
Figure 1 shows typical MT9D112 device connections. For low-noise operation, the MT9D112 requires separate power supplies for analog and digital. Incoming digital and analog ground conductors can be tied together next to the die. Both power supply rails should be decoupled to ground using capacitors as close as possible to the die. The use of inductance filters is not recommended on the power supplies or output signals. The MT9D112 also supports different digital core (VDD/DGND) and I/O power (VDD_IO/ DGND) power domains that can be at different voltages. The PLL requires a clean power source (VDDPLL). Figure 1: Typical Configuration (connections)
Digital I/O Power PLL Power Digital Core Analog Power Power
VDD_AF RPULL-UP5 SADDR SDATA SCLK
VDD_IO6
VDDPLL
VDD
VAA
VAA_PIX
Two-wire serial interface Active LOW reset Standby mode Core SHUTDOWN External clock in (6-54 MHz) General purpose I/Os (MODULE_ID, FLASH, SHUTTER) AF control I/Os
DOUT[7:0] PIXCLK LINE_VALID FRAME_VALID DOUT_N DOUT_P CLK_N CLK_P To parallel camera port
RESET_BAR STANDBY SHUTDOWN EXTCLK GPI0[3:0]3 GPI0_AF[7:0]2 TEST_EN DGND GND_IO GND_AF
OR4
To serial camera port
AGND
VDD_IO6
VDD_AF
VDDPLL
VDD
VAA
VAA_PIX
It is recommended that 0.1F and 1F decoupling capacitors for each power supply are mounted as close as possible to the pad. Actual values and results may vary depending on layout and design considerations.
Notes:
1. This typical configuration shows only one scenario out of multiple possible variations for this sensor. 2. If auto focus is not required, the following pads can be left floating: VDD_AF, GND_AF, and GPIO_AF. 3. The GPIO pads can serve multiple functions and can be reconfigured. The function and direction will vary by application. 4. Only one of the output modes (serial or parallel) can be used at any time. 5. A resister value of 1.5K is recommended for the two-wire serial interface RPULL-UP, however, a greater value may be used for slower transmission speed. 6. All inputs must be configured with VDD_IO. 7. VAA and VAA_PIX must be tied together.
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MT9D112: 1/4-Inch 2Mp SOC Digital Image Sensor Architecture Overview
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Architecture Overview
The MT9D112 combines a 2Mp sensor core together with an image flow processor (IFP) to form a stand-alone solution that includes both image acquisition and processing. The processed image data is transmitted to the host-system either via a parallel bus or a serial data interface through the output interface. In normal operation, an integrated microcontroller (MCU) controls most aspects of operation autonomously. This includes the control over key internal registers for both sensor core and the IFP settings. However, registers can be controlled by the user as well. This can be achieved by either controlling registers through the MCU, or by disabling the MCU for direct control. Figure 2: SOC Block Diagram
Image Flow Processor Interpolation Line Buffers Decimator Line Buffers Output Interface
Sens or C ore PLL
Color Pipeline Stats Engine Internal Register Bus
FIFO
MIPI
ROM (32kB)
Microcontroller (68H11)
SRAM (2kB)
Sensor Core Description
The sensor core of the MT9D112 is a progressive-scan sensor that generates a stream of pixel data at a constant frame rate, qualified by LINE_VALID and FRAME_VALID. The maximum pixel rate is 40 megapixels/second, corresponding to a pixel clock rate of 80 MHz. Figure 3 on page 12 shows a block diagram of the sensor core. It includes a 2-megapixel active-pixel array. The timing and control circuitry sequences through the rows of the array, resetting and then reading each row in turn. In the time interval between resetting a row and reading that row, the pixels in the row integrate incident light. The exposure is controlled by varying the time interval between reset and readout. Once a row has been read, the data from the columns is sequenced through an analog signal chain (providing offset correction and gain), and then through an ADC. The output from the ADC is a 10-bit value for each pixel in the array. The pixel array contains optically active and light-shielded (dark) pixels. The dark pixels are used to provide data for the offset-correction algorithms (black level control). The sensor core contains a set of control and status registers that can be used to control many aspects of the sensor behavior including the frame size, exposure, and gain setting. These registers are controlled by the SOC firmware and can be accessed through the two-wire serial interface. Note that register values written to the sensor core may be overwritten by firmware. The output from the core is a Bayer pattern; alternate rows are a sequence of either green/red pixels or blue/green pixels. The offset and gain stages of the analog signal chain provide per-color control of the pixel data.
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MT9D112: 1/4-Inch 2Mp SOC Digital Image Sensor Sensor Core Description
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A flash strobe output signal is provided to allow an external xenon or LED light source to synchronize with the sensor exposure time. Additional I/O signals support the provision of an external mechanical shutter. Figure 3: Sensor Core Block Diagram
Control Registers PLL
Timing and Control
Active -Pixel Sensor (APS ) Array
Green1/Green 2 Channel
G1/G2
ADC
G 1/G2
Analog Processing
Red /Blue Channel R/B
Digital Processing ADC
R /B
10-BIT Data Out
Sensor Core
Pixel Array
Pixel Array Structure
The sensor core pixel array is configured as 1,722 columns by 1,262 rows (shown in Figure 4). The first 100 columns and the first 39 rows of pixels are optically black and are used for the automatic black level adjustment; the last 6 columns are also optically black. The optically active pixels are used as follows: In default mode a UXGA image (1,616 columns by 1,216 rows) is generated, starting at row 40, column 101. An 8-pixel boundary of active pixels is enabled around the image to avoid boundary effects during color interpolation and correction. Figure 4: Pixel Array
(0,0) 39 black rows
Oversize UXGA 6 black columns
1616 x 1216 active pixels
100 black columns
7 black rows (1721, 1261)
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MT9D112: 1/4-Inch 2Mp SOC Digital Image Sensor Sensor Core Description
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The sensor core uses a Bayer color pattern, as shown in Figure 5. The even-numbered rows contain green and red color pixels; odd-numbered rows contain blue and green color pixels. Even-numbered columns contain green and blue color pixels; oddnumbered columns contain red and green color pixels. Figure 5: Pixel Color Pattern Detail (Top Right Corner)
Column Readout Direction
. . .
Black Pixels First Clear Pixel (99,38)
Row Readout Direction
B G2 B G2 B G2
... G1 R G1 R G1 R
B G2 B G2 B G2 G1 R G1 R G1 R B G2 B G2 B G2
Default Readout Order
By convention, the sensor core pixel array is shown with pixel (0,0) in the top right-hand corner (see Figure 5). This reflects the actual layout of the array on the die. When the sensor is imaging in a system, the active surface of the sensor faces the scene as shown in Figure 6. When the image is read out of the sensor, it is read one row at a time, with the rows and columns sequenced. By convention, data from the sensor is shown with the first pixel read out--pixel (99,38) in the case of the sensor core--in the top lefthand corner. Figure 6: Imaging a Scene
Lens Scene
Sensor (rear view)
Row Readout Order Column Readout Order Pixel (0,0)
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MT9D112: 1/4-Inch 2Mp SOC Digital Image Sensor Sensor Core Description
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Analog Processing
Analog Readout Channel
The sensor core features two identical analog readout channels as shown in Figure 3 on page 12. The readout channel consists of two gain stages, a sample-and-hold stage with black level calibration capability, and a 10-bit ADC.
Timing and Control
Gain Options
The MT9D112 provides per-color gain control as well as the option of global gain control. Per-color and global gain control can be used interchangeably. A write to a global gain register is aliased as a write of the same data to the four associated colordependent gain registers. Integer digital gains in the range 0-7 can be programmed. A digital gain of "0" sets all pixel values to 0 (the pixel data will simply represent the value applied by the pedestal block). Gain settings are updated every frame by the MCU auto feature; to make manual adjustments to gain settings, the MCU auto features must be disabled.
Integration Time
The integration (exposure) time of the MT9D112 is controlled by the fine_integration_time and coarse_integration_time registers. While coarse integration time controls the integration duration steps of lines, the fine time allows for sub-line accuracy. Integration time is updated every frame by the MCU auto feature; to make manual adjustments to integration time, the MCU auto features must be disabled. The limits for the fine integration time are defined by: sensor_fine_IT_min_A/B = ((x_addr_end - x_addr_start + 1)/xskip) + min_line_blanking_pck. min_line_blanking_pck is 476 in full resolution mode, 743 in high-power preview mode, and 442 in low-power preview mode. coarse_integration_time is value of R0x3012 fine_integration_time is value of R0x3014 x_addr_end is a value of R0x3008 x_addr_start is a value of R0x3004 xskip is a value of R0x3016[7:5]
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MT9D112: 1/4-Inch 2Mp SOC Digital Image Sensor Sensor Core Description
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vt_pix_clk_freq_mhz is MCLK/2 It is fundamental to the operation of an electronic rolling shutter (ERS) that it is not possible to set an integration time that is greater than the frame time. Unlike earlier Aptina Imaging parts, setting an integration time that is greater than the frame time does not affect the frame time; the behavior is undefined. On the MT9D112, it is necessary to reprogram the frame time (frame_length_lines) in order to make longer exposure times available. Long integration times increase the likelihood of image degradation due to increased accumulation of dark current. If the integration time is changed while FRAME_VALID is asserted for frame n, the firstframe output using the new integration time is frame (n + 2). The sequence is as follows: 1. During frame n, the new integration time is held in the pending register. 2. At the start of frame (n + 1), the new integration time is transferred to the live register. Integration for each row of frame (n + 1) has been completed using the old integration time. 3. The earliest time that a row can start integrating using the new integration time is immediately after that row has been read for frame (n + 1). The actual time that rows start integrating using the new integration time is dependent upon the new value of the integration time. 4. When frame (n + 2) is read out, it is integrated using the new integration time. If the integration time is changed on successive frames, each value written will be applied for a single frame; the latency between writing a value and it affecting the frame readout remains at two frames. When the integration time and the gain are changed at the same time, the gain update is held off by one frame so that the first frame output with the new integration time also has the new gain applied.
PLL
PLL-Generated Master Clock
The PLL can generate a master clock signal whose frequency is up to 80 MHz (input clock from 6 MHz through 54 MHz). R0x341C controls the frequency of the PLL-generated clock. It is possible to bypass the PLL and use CLKIN as master clock. In order to do so, one must set R0x341E[0] to "1." If power consumption is a concern, R0x341E[1] should be also set to "1" a short time later, to put the bypassed PLL in power-down mode. To enable the PLL again, the two bits must be set to "0" in the reverse order. By default, the PLL is bypassed and powered down.
PLL Setup
Because the input clock frequency is unknown, the part starts with the PLL disabled. The PLL takes time to power up. During this time, the behavior of its output clock signal is not guaranteed. The PLL output frequency is determined by two constants, M and N, and the input clock frequency. PLL programming and power-up sequence is as follows: 1. Program PLL frequency settings, R0x341C (pll_m, pll_n) (master clock frequency is equal to fVCO_pll/8). With default settings master clock frequency of 80 MHz is obtained with fCLKIN=16 MHz. 2. Power up PLL, R0x341E[1] = 0. 3. Wait for PLL settling time > 1ms. 4. Turn off PLL bypass, R0x341E[0] = 0.
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MT9D112: 1/4-Inch 2Mp SOC Digital Image Sensor Sensor Core Description
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Allow one complete frame to effect the correct integration time after enabling PLL. Note: Before enabling PLL, ensure the slew rate is optimized for pads. The default M and N values are for 16 MHz. Note: Any changes to PLL settings must be done with PLL bypassed (R0x341E[0]=1). Also, EXTCLK must remain at a stable frequency with no missing pulses to ensure correct PLL operation. If the clock frequency is changed (or if pulses are missed) while the PLL is enabled, sensor operation is UNDEFINED. Depending on the duration and magnitude of the disturbance, frame rate will drop, frames will be corrupted, and the sensor may become non-functional. The proper sequence for changing PLL settings is: bypass the PLL, change the PLL settings, wait at least 1ms, disable PLL bypass.
Table 4:
Frequency Parameters
Frequency
fIN fPFD fVCO
Equation -
fclkin /(pll_n+1) fclkin * pll_m/(pll_n+1)
Min (MHz) 6 2 320
Max (MHz) 54 20 640
Readout Options
The sensor core supports different readout options to modify the image before it is sent to the IFP. The readout can be limited to a specific window of the original pixel array. For preview modes, the sensor core supports both skipping and pixel averaging in x and y directions. By changing the readout direction the image can be flipped in the vertical and/or mirrored in the horizontal.
Window Size
The image output size is set with registers x_addr_start, x_addr_end, y_addr_start, and y_addr_end. The edge pixels in the 1,616 x 1,216 array are present to avoid edge defects and should not be included in the visible window. Binning will change the image output size.
Readout Modes
Horizontal Mirror
When the horizontal_mirror bit (R0x3040[0]) is set in the read mode register, the order of pixel readout within a row is reversed, so that readout starts from x_addr_end and ends at x_addr_start. Figure 7 on page 17 shows a sequence of 6 pixels being read out with horizontal_mirror=0 and horizontal_mirror=1. Changing horizontal_mirror causes the Bayer order of the output image to change; the new Bayer order is reflected in the value of the pixel_order register. This change in sensor core output is corrected for by the SOC.
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MT9D112: 1/4-Inch 2Mp SOC Digital Image Sensor Sensor Core Description
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Figure 7:
6 Pixels in Normal and Column Mirror Readout Modes
LINE_VALID Normal readout DOUT0-DOUT9 Reverse readout DOUT0-DOUT9 G3 (9:0) R2 (9:0) G2 (9:0) R1 (9:0) G1 (9:0) R0 (9:0) G0 (9:0) R0 (9:0) G1 (9:0) R1 (9:0) G2 (9:0) R2 (9:0)
Vertical Flip
When the vertical flip bit (R0x3040[1]) is set in the read mode register, the order in which pixel rows are read out is reversed, so that row readout starts from y_addr_end and ends at y_addr_start. Figure 8 shows a sequence of 6 rows being read out with row mirror=0 and row mirror=1. Changing vertical_flip causes the Bayer order of the output image to change; the new Bayer order is reflected in the value of the pixel_order register. This change in sensor core output is corrected for by the SOC. Figure 8: 6 Rows in Normal and Row Mirror Readout Modes
FRAME_VALID Normal readout DOUT0-DOUT9 Reverse readout DOUT0-DOUT9 Row6 (9:0) Row5 (9:0) Row4 (9:0) Row3 (9:0) Row2 (9:0) Row1 (9:0) Row0 (9:0) Row1 (9:0) Row2 (9:0) Row3 (9:0) Row4 (9:0) Row5 (9:0)
Column and Row Skip
The sensor core supports subsampling. Subsampling reduces the amount of data processed by the analog signal chain in the sensor and thereby allows the frame rate to be increased. Subsampling is enabled by setting x_odd_inc=3 and/or y_odd_inc=3. This reduces the amount of row and column data processed and is equivalent to the skip2 readout mode provided by earlier Aptina Imaging sensors. When enabling skipping, the proper image output and crop sizes must be updated beforehand.
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Figure 9:
8 Pixels in Normal and Column Skip 2X Readout Modes
LINE_VALID Normal readout DOUT0-DOUT9 G0 (9:0) R0 (9:0) G1 (9:0) R1 (9:0) G2 (9:0) R2 (9:0) G3 (9:0) R3 (9:0)
LINE_VALID Column skip readout DOUT0-DOUT9 G0 (9:0) R0 (9:0) G2 (9:0) R2 (9:0)
The following waveform shows a sequence of data being read out with x_odd_inc=3 and y_odd_inc=1. The effect of the different subsampling settings on the pixel array readout is shown in Figures 10 through 13. Figure 10: Pixel Readout (no skipping)
X incrementing
Figure 11:
Pixel Readout (x_odd_inc=3, y_odd_inc=1)
X incrementing
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Y incrementing
Y incrementing
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Figure 12:
Pixel Readout (x_odd_inc=1, y_odd_inc=3)
X incrementing
Y incrementing
Figure 13:
Pixel Readout (x_odd_inc=3, y_odd_inc=3)
X incrementing
Y incrementing
Programming Restrictions when Skipping
When skipping is enabled as a viewfinder mode, and the sensor is switched back and forth between full resolution and skipping, it is recommended that line_length_pck be kept constant between the two modes. This allows the same integration times to be used in each mode. When subsampling is enabled, it may be necessary to adjust the x_addr_end and y_addr_end settings. The values for these registers are required to correspond with rows/ columns that form part of the subsampling sequence. The adjustment should be made in accordance with the following rule: remainder = (addr_end - addr_start + 1) AND 4; if (remainder == 0) addr_end = addr_end - 2;
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Table 5 shows the row address sequencing for normal and subsampled (with y_odd_inc=3) readout. The same sequencing applies to column addresses for subsampled readout. There are two possible subsampling sequences (because the subsampling sequence only reads half of the rows and columns) depending upon the alignment of the start address. Table 5:
Normal 0 1 2 3 4 5 6 7
Row Address Sequencing
Skipping (start divides by 4) 0 1 2 3 4 5 6 7 4, 6 5, 7 6, 8 7, 9 Skipping (start does not divide by 4) Binned (start divides by 4) 0, 2 1, 3 2, 4 3, 5 Binned (start does not divide by 4)
Binning
The MT9D112 sensor core supports 2x1 and 2x2 analog binning (column binning, also called x-binning and row/column binning, also called xy-binning). Binning has many of the same characteristics as subsampling but because it gathers image data from all pixels in the active window (rather than a subset of them), it achieves superior image quality and avoids the aliasing artifacts that can be a characteristic side effect of subsampling. Binning is enabled by selecting the appropriate subsampling settings (x_odd_inc=3 and y_odd_inc=1 for x-binning, x_odd_inc=3 and y_odd_inc=3 for xy-binning) and setting the appropriate binning bit in read_mode (R0x3040-1). As for subsampling, x_addr_end and y_addr_end may require adjustment when binning is enabled. The effect of the different subsampling settings is shown in Figure 14 and Figure 15. Figure 14: Pixel Readout (x_odd_inc=3, y_odd_inc=1, x_bin=1)
X incrementing
Y incrementing
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Figure 15:
Pixel Readout (x_odd_inc=3, y_odd_inc=3, x_ybin=1)
X incrementing
Y incrementing
Binning Limitations
Binning requires different sequencing of the pixel array and imposes different timing limits on the operation of the sensor. In particular, xy-binning requires two read operations from the pixel array for each line of output data, which has the effect of increasing the minimum line blanking time. As a result, when xy-binning is enabled, some of the programming limits declared in the parameter limit registers are no longer valid. In addition, the default values for some of the manufacturer-specific registers need to be reprogrammed. None of these adjustments are required for x-binning. The sensor must be taken out of streaming mode before switching between binned and non-binned operation.
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Raw Data Format
The sensor core image data is read out in a progressive scan. Valid image data is surrounded by horizontal blanking and vertical blanking as shown in Figure 16. The amount of horizontal blanking and vertical blanking is programmable. LINE_VALID is HIGH during the shaded region of the figure. FRAME_VALID timing is described in the next section. Figure 16: Pixel Data Timing Example
P0,0 P0,1 P0,2................................P0,n-1 P0,n P1,0 P1,1 P1,2................................P1,n-1 P1,n 00 00 00 ............. 00 00 00 00 00 00 ............. 00 00 00
VALID IMAGE
HORIZONTAL BLANKING
Pm-1,0 Pm-1,1.........................Pm-1,n-1 Pm-1,n Pm,0 Pm,1.........................Pm,n-1 Pm,n 00 00 00 ..................................... 00 00 00 00 00 00 ..................................... 00 00 00 VERTICAL BLANKING 00 00 00 ................................ 00 00 00 00 00 00 ................................ 00 00 00
00 00 00 ............. 00 00 00 00 00 00 ............. 00 00 00 00 00 00 ............. 00 00 00 00 00 00 ............. 00 00 00 VERTICAL/HORIZONTAL BLANKING 00 00 00 ............. 00 00 00 00 00 00 ............. 00 00 00
Raw Data Timing
The sensor core output data is synchronized with the PIXCLK output. When LINE_VALID is HIGH, one pixel data is output on the 10-bit DOUT output every PIXCLK period. By default, the PIXCLK signal runs at half the frequency as the master clock, and its falling edges occur one master clock period (half PIXCLK period) after transitions on LINE_VALID, FRAME_VALID, and DOUT (Figure 17). This allows PIXCLK to be used as a clock to sample the data. PIXCLK is continuously enabled, even during the blanking period. Figure 17: Pixel Data Timing Example
LINE_VALID
PIXCLK
Blanking
Valid Image Data
Blanking
DOUT0-DOUT9
P0 (9:0)
P1 (9:0)
P2 (9:0)
P3 (9:0)
P4 (9:0)
Pn-1 (9:0)
Pn (9:0)
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MT9D112: 1/4-Inch 2Mp SOC Digital Image Sensor Sensor Core Description
Figure 18: Row Timing and FRAME_VALID/LINE_VALID Signals
FRAME_VALID
www..co
LINE_VALID
Number of master clocks
P
A
Q
A
Q
A
P
The sensor timing is shown in terms of pixel clock and master clock cycles (Figure 17 and Figure 18). Increasing the integration time to more than one frame causes the frame time to be extended. Table 6:
Parameter
Row Timing Parameters
Name PLL Off PLL On Skip (subsampling) factor Equation 2*R0x3016[2:0]/fCLKIN (16*R0x3016[2:0]*(pll_n+1))/(fCLKIN*pll_m) For x_odd_inc=y_odd_inc=3, S=2 Otherwise, S=1 (x_addr_end-x_addr_start+1)*PIXCLK_PERIOD/S 6*PIXCLK_PERIOD (line_length_pck*PIXCLK_PERIOD)-A line_length_pck*PIXCLK_PERIOD (y_addr_end-y_addr_start +1)/S ([frame_length_lines-N]*[A+Q])+Q-(2*P) (N*(A+Q))-Q+(2*P) line_length_pck*frame_length_lines*PIXCLK_PERIOD Default at CLKIN = 54 MHz (PLL Off) 1 pixel clock = 37.04ns 1 1,608 pixel clocks = 59.56?s 6 pixel clocks = 222.22ns 476 pixel clocks = 17.63s 2,084 pixel clocks = 77.19s 1,208 rows 110,916 pixel clocks = 4.108ms 2,517,008 pixel clocks = 93.22ms 2,627,924 pixel clocks = 97.33ms
PIXCLK_PERIOD Pixel clock period S A P Q A+Q N V Tfv F
Active data time Frame start/end blanking Horizontal blanking Row time Number of rows Vertical blanking Frame valid time Total frame time
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SOC Description
Image Flow Processor
Image and color processing in the MT9D112 is implemented as an image flow processor coded in hardware logic. The IFP can be controlled by registers from the outside but during normal operation, the embedded microcontroller will automatically adjust the operation parameters. The IFP is broken down into different sections outlined in Figure 19. Figure 19: Color Pipeline
Pixel Array ADC
Test Pattern Generator
RAW DATA BYPASS
First Digital Gain Control
First Black Level Subtraction
RAW 10
Lens Shading Correction
Line Buffers
Defect Correction Noise Reduction
Color Interpolation
Statistics Engine
Special Effects
8-bit RGB
Second Black Level Subtraction RGB to YUV
Color Correction
Color Kill
Aperture Correction
YUV Color Filters
8-bit YUV
Cropping / Windowing Decimator Line Buffers
Gamma Correction (10-to-8 Lookup )
Output Formatting YUV to RGB
10/12-Bit RGB
MIPI Output FIFO
Shared SRAM
Output FIFO
Output Format
Serial Output
Parallel Output
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Test Patterns
During normal operation of the MT9D112, a stream of raw image data from the sensor core is continuously fed into the color pipeline. For test purposes, this stream can be replaced with a fixed image generated by a special test module in the pipeline. The module provides a selection of test patterns sufficient for basic testing of the pipeline. Test patterns are accessible using R0x3290 and are shown in Figure 20. Disabling MCU is recommended before enabling test patterns.
Figure 20:
Test Patterns
Test Pattern
Register Value
Example
Flat Field
R0x3290 = 1
Vertical Ramp
R0x3290 = 2
Color Bar
R0x3290 = 3
Vertical Stripes
R0x3290 = 4
Pseudo-Random
R0x3290 = 5
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First Black Level Subtraction and Digital Gain
Image stream processing starts with black level subtraction (R0x3278) and multiplication of all pixel values by a programmable digital gain (R0x32DC). Both operations can be independently set to separate values for each color channel (R, Gr, Gb, B). Independent color channel digital gain is adjusted with registers R0x32D4 through R0x32DA. Independent color channel black level adjustments can be made with R0x327A through R0x3280. If the black level subtraction produces a negative result for a particular pixel, the value of this pixel is set to "1."
Lens Shading Correction
Lenses tend to produce images whose brightness is significantly attenuated near the edges. There are also other factors causing fixed pattern signal gradients in images captured by image sensors. The cumulative result of all these factors is known as lens shading. The MT9D112 has an embedded lens shading correction (LC) module that can be programmed to counter the shading effect of a lens on each individual R, Gb, Gr, and B color signal. The LC module multiplies R, Gb, Gr, and B signals by a 2-dimensional correction function F (x,y), whose profile in both x and y direction is a piecewise quadratic polynomial with coefficients independently programmable for each direction and color. Lens shading correction can be enabled and disabled with R0x3210[2]. The MT9D112 also includes 16 independent corner parameters, K, for each of the color channels. The K factors are independently adjustable at each corner and are not dependent on the vertical and horizontal spatial dimension. They can be adjusted with R0x3544 through R0x3562. Lens shading correction can be enabled and disabled with R0x3210[2].
Lens Correction Zones
In order to increase the precision of the correction function, the image plane is divided into 8 zones in each dimension. The coordinates of zone boundaries are referenced with respect to the lens center, C. Each boundary as well as C (Cx, Cy) coordinate is stored as a byte, which represents the coordinate value divided by 4. There always three boundaries to the left (top) of the center and three to the right (bottom) of the center. These boundaries apply uniformly for all color channels. However, the correction functions are programmable independently for each color component. Boundary and lens center positions are also valid for the preview mode. Figure 21 on page 27 illustrates the lens correction zones, which are accessible through registers R0x34CE through R0x34DC.
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Figure 21:
Lens Correction Zones
X
CY
Array Center
X
CX
Y 2
X
3 X 4 X
Y 1
Y 3
X
2
Y 4
1
5
Defect Correction and Noise Reduction
The IFP performs on-the-fly defect correction that can mask pixel array defects such as high dark current (hot) pixels and pixels that are darker or brighter than their neighbors due to photoresponse nonuniformity. Each pixel is compared with its 8 nearest neighbors having the same filter color. Suppose the value of the compared pixel is P and the values of the 8 neighbors range from PMIN to PMAX. If P > PMAX, P is replaced with PMAX. Likewise, if P < PMIN, P is replaced with PMIN. Otherwise, the pixel is not considered defective, and its value P is not changed. Defect correction can be enabled and disabled with R0x3210[3]. The image data for each color channel can be passed through an adaptive noise suppression module which averages over flat field areas while preserving edge information. The module is edge aware with exposure that is based on configurable thresholds. The thresholds are changed on the fly based on the brightness of the current scene. Noise reduction can be enabled and disabled with R0x33F4[3] and thresholds are set by R0x33F6 through R0x33FC.
Color Interpolation and Edge Detection
In the raw data stream fed by the sensor core to the IFP each pixel is represented by a 10, bit integer number, which can be considered proportional to the pixel's response to a one-color light stimulus, red, green or blue, depending on the pixel's position under the color filter array. Initial data processing steps, up to and including the defect correction, preserve the 1-color-per-pixel nature of the data stream, but after the defect correction it must be converted to a 3-colors-per-pixel stream appropriate for standard color processing. The conversion is done by an edge-sensitive color interpolation module. The module pads the incomplete color information available for each pixel with information extracted from an appropriate set of neighboring pixels. The algorithm used to select this set and extract the information seeks the best compromise between preserving edges and filtering out high frequency noise in flat field areas. The edge threshold can be set with R0x328E.
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Y 0
27
Y 5
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X
0
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Second Black Level Correction
After interpolation it might be necessary to recalibrate the black level. A second global black level substraction is possible at this stage in the pipeline, which is controlled via R0x3276. If the subtraction produces a negative result for a particular pixel, the value of this pixel is set to "0."
Color Correction and Aperture Correction
To achieve good color fidelity of IFP output, interpolated RGB values of all pixels are subjected to color correction. The IFP multiplies each vector of three pixel colors by a 3 x 3 color correction matrix. The three components of the resulting color vector are all sums of three 10-bit numbers. Since such sums can have up to 12 significant bits, the bit width of the image data stream is widened to 12 bits per color (36 bits per pixel). The color correction matrix can be either programmed by the user or automatically selected by the auto white balance (AWB) algorithm implemented in the IFP. Color correction should ideally produce output colors that are independent of the spectral sensitivity and color crosstalk characteristics of the image sensor. The optimal values of color correction matrix elements depend on those sensor characteristics and on the spectrum of light incident on the sensor. The color correction variables can be adjusted with R0x006 through R0x042. To increase image sharpness, a programmable 1D or 2D aperture correction (sharpening filter) is applied to color corrected image data. Aperture correction is enabled using R0x3210. The gain and threshold for 1D and 2D correction can be defined via R0x326A and R0x326C.
Image Cropping
Image cropping takes place when the sensor core is programmed to output pixel values from a rectangular portion of its pixel array-a window-smaller than the default 1,600 x 1,200 window. Pixels outside the selected cropping window are not read out, resulting in a narrower field of view than at the default sensor settings. Irrespective of the size and position of the cropping window, the MT9D112 sensor core can also decimate outgoing images by skipping columns and/or rows of the pixel array, and/or by binning 2 x 2 groups of pixels of the same color. Since scaling by skipping (deletion) can cause aliasing (even if pixel binning is simultaneously enabled), it is generally better to change image size only by cropping and pixel binning. In context A, the cropped window is defined by variables 0x051 through 0x057. In context B, it is defined by 0x05F and 0x065. In context A and B, the height and width definitions for the output window must be equal to or smaller than the cropped image. Output width will always be as with no scaling; crop will still be in effect.
Contrast and Gamma Correction
Gamma correction is independently applied and independently configurable for each of the 12-bit R, G, and B color channels. The gamma correction curve is implemented as a piecewise linear function with 19 knee points, taking 12-bit arguments and mapping them to 8-bit output. The abscissas of the knee points are fixed at 0, 64, 128, 256, 512, 768, 1024, 1280, 1536, 1792, 2048, 2304, 2560, 2816, 3072, 3328, 3584, 3840, and 4096. The 8-bit ordinates are programmable through the IFP registers. The MT9D112 IFP includes a block for gamma and contrast correction. A custom gamma/contrast correction table may be uploaded, or preset gamma and contrast settings may be selected.
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The gamma and contrast correction block uses the following 12-bit input data points to form a piecewise linear transformation curve: 0, 64, 128, 256, 512, 768, 1024, 1280, 1536, 1792, 2048, 2304, 2560, 2816, 3072, 3328, 3584, 3840, and 4096. These input points have been selected to provide more detail to the low end of the curve where gamma correction changes are typically the greatest. These points correspond to 8-bit output values that can be uploaded to the appropriate registers. Figure 22: Gamma Correction Curve
Gamma Correction
300 250
Output RGB, 8-bit
200 150 100 50 0 0 1000 2000 Input RGB, 12-bit 3000 4000 0.45
For simplicity, predefined gamma and contrast tables may be selected, and the MT9D112 automatically combines these tables and upload them to the appropriate gamma correction registers. The gamma and contrast tables may be selected at mode driver (ID = 7) offsets 109 and 110 (decimal) for context A and context B, respectively. The gamma settings are established at bits 0-2, and the contrast settings are established at bits 4-6. The gamma setting values are shown in Table 7. Table 7: Gamma Settings
Gamma Setting 0 1 2 3 Definition Gamma = 1.0 (no gamma correction) Gamma = 0.56 Gamma = 0.45 Use user-defined gamma table
S-Curve
The predefined contrast table values have been established by creating an "S" curve with highlight and shadow regions that blend smoothly with a linear midtone region. The slope and value of the highlight and shadow regions match the linear region at these transitions. In addition, the slope of the "S" curve is zero at the top (white) and bottom (black) points. The slope of the linear region determines how much contrast is applied; more contrast corresponds to a higher, midtone linear slope.
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Figure 23:
Contrast "S" Curve
Table 8:
Contrast Values
Contrast Setting 0 1 2 3 4 Definition No contrast correction Contrast slope = 1.25 Contrast slope = 1.50 Contrast slope = 1.75 Noise reduction contrast
The contrast curve function is applied to the gamma curve points used (whether the gamma curve points are predefined or user-uploaded). S-curve is a function to correct image pixel values. When applied to pixel values, it typically compresses dark and bright tones, while stretching the midtones. Special effects like negative image, sepia, or B/W can be applied to the data stream at this point. Special effects are enabled with R0x3348.
RGB to YUV Conversion
For further processing the data is converted from RGB color space to YUV color space.
Color Kill
To remove high light or low light color artifacts, a color kill circuit is included. It affects only pixels whose luminance exceeds a certain preprogrammed threshold. The U and V values of those pixels are attenuated proportionally to the difference between their luminance and the threshold.
YUV Color Filter
As an optional processing step noise suppression by 1-dimensional low-pass filtering of Y and/or UV signals is possible. A 3- or 5-tap filter can be selected for each signal.
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Image Scaling
To ensure that the size of images output by the MT9D112 can be tailored to the needs of all users, the IFP includes a scaler module. When enabled, this module performs rescaling of incoming images--shrinks them to arbitrarily selected width and height without reducing the field of view and without discarding any pixel values. The scaler performs pixel binning--divides each input image into rectangular bins corresponding to individual pixels of the desired output image, averages pixel values in these bins, and assembles the output image from the bin averages. Pixels lying on bin boundaries contribute to more than one bin average: their values are added to bin-wide sums of pixel values with fractional weights. The entire procedure preserves all image information that can be included in the downsized output image and filters out high frequency features that could cause aliasing. The image cropping and scaler module can be used together to implement a digital zoom and pan. If the scaler is programmed to output images smaller than images coming from the sensor core, zoom effect can be produced by cropping the latter from their maximum size down to the size of the output images. The ratio of these two sizes determines the maximum attainable zoom factor. For example, a 1,600 x 1,200 image rendered on a 160 x 120 display can be zoomed up to 10 times, since 1,600/160 = 1,200/ 120 = 10. Panning effect can be achieved by fixing the size of the cropping window and moving it around the pixel array. Due to the loss of sharpness due to pixel binning during image scaling, 1D aperture correction may be applied to increase image sharpness lost due to pixel binning during image scaling.
YUV-to-RGB/YUV Conversion and Output Formatting
The YUV data stream emerging from the scaler module can either exit the color pipeline as-is or be converted before exit to an alternative YUV or RGB data format as selected by R0x332E.
Color Conversion Formulas
Y'U'V'
This conversion is BT 601 scaled to make YUV range from 0 through 255. This setting is recommended for JPEG encoding and is the most popular, although it is not well defined and is often misused in Windows. Y' = 0.299 R' + 0.587 G' + 0.114 B' U' = 0.564 (B' - Y') + 128 V' = 0.713 (R' - Y') + 128
There is an option where 128 is not added to U'V'.
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Y'Cb'Cr' Using sRGB Formulas
The MT9D112 implements the sRGB standard. This option provides YCbCr coefficients for a correct 4:2:2 transmission. Note that 16 < Y60 1< 235, 16 < Cb, Cr < 240 and 0 < = RGB < = 255. Y' = (0.2126*R' + 0.7152*G' + 0.0722*B')*219/256 + 16 Cb' = 0.5389*(B '- Y')*224/256 + 128 Cr' = 0.635*(R' - Y')*224/256 + 128
Y'U'V' Using sRGB Formulas
Similar to the previous set of formulas, but has YUV spanning a range of 0 through 255. Y' = 0.2126*R' + 0.7152*G' + 0.0722*B' U' = 0.5389*(B' - Y') + 128 = -0.1146*R - 0.3854*G + 0.5*B V' = 0.635*(R' - Y') + 128 = 0.5*R - 0.4542*G - 0.0458*B There is an option to disable adding 128 to U'V'. The reverse transform is as follows: R' = Y + 1.5748*V G' = Y - 0.1873*(U - 128) - 0.4681*(V - 128) B' = Y + 1.8556*(U - 128)
Output Interface
Parallel and MIPI Output
The user can select to either use the serial MIPI output or the 8-bit parallel output to transmit the data. Only one of the output modes can be used at any time. The parallel output, enabled by R0x301A[7], can be used with an output FIFO whose memory is shared with the MIPI output FIFO to retain a constant pixel output clock independent from the scaling factor. When scaling the image or skipping lines, the data would be generated in bursts and the pixel clock would turn on and off in intervals, which might lead to EMI problems. The output FIFO will group all active pixel data together so the pixel clock can be run at a constant speed. The output FIFO is enabled by setting R0x3212[1:0] to 10. There are two registers to configure the output FIFO, watermark and line length. The MIPI output transmitter implements a fully configurable serial differential subLVDS transmitter capable of up to 640 Mb/s. It supports multiple formats, error checking, and custom short packets.
Output Format and Timing YUV/RGB Uncompressed Output
Uncompressed YUV or RGB data can be output either directly from the output formatting block or through a FIFO buffer with a capacity of 800 bytes, enough to hold onefourth of an uncompressed line at full resolution. Buffering of data is a way to equalize the data output rate when image scaling is used. Scaling produces an intermittent data stream consisting of short high-rate bursts separated by idle periods. High pixel clock frequency during bursts may be undesirable due to EMI concerns.
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Figure 24 on page 33 depicts the output timing of uncompressed YUV/RGB when a decimated data stream is equalized by buffering or when no scaling takes place. The pixel clock frequency remains constant during each LINE_VALID HIGH period. Decimated data are output at a lower frequency than full size frames, which helps to reduce EMI. Figure 24: Timing of Uncompressed Full Frame Output or Decimated Output Passing Through the FIFO
FRAME_VALID LINE_VALID
PIXCLK DOUT[7:0]
Uncompressed YUV/RGB Data Ordering
The MT9D112 supports swapping YCrCb mode, as illustrated in Table 9. Table 9: YCrCb Output Data Ordering
Mode Default (no swap) Swapped CrCb Swapped YC Swapped CrCb, YC Cbi Cri Yi Yi Yi Yi Cbi Cri Cri Cbi Yi+1 Yi+1 Yi+1 Yi+1 Cri Cbi
The RGB output data ordering in default mode is shown in Table 10. The odd and even bytes are swapped when luma/chroma swap is enabled. R and B channels are bit-wise swapped when chroma swap is enabled. Table 10: RGB Ordering in Default Mode
Mode (Swap Disabled) RGB 565 RGB 555 RGB 444x RGB x444 Byte Odd Even Odd Even Odd Even Odd Even D7D6D5D4D3D2D1D0 R7R6R5R4R3G7G6G5 G4G3G2B7B6B5B4B3 0 R7R6R5R4R3G7G6 G4G3G2B7B6B5B4B3 R7R6R5R4G7G6G5G4 B7B6B5B4 0 0 0 0 0 0 0 0 R7R66R5R4 G7G6G5G4B7B6B5B4
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Uncompressed 10-Bit Bypass Output
Raw 10-bit Bayer data from the sensor core can be output in bypass mode in two ways: 1. Using 8 data output pads (DOUT0-DOUT7), and GPIO[0:1]. 2. Using only 8 pads (DOUT0-DOUT7) and a special 8 + 2 data format, shown in Table 11. The timing of 10-bit or 8-bit data stream output in the bypass mode is qualitatively the same as that depicted in Figure 25 on page 34. Table 11: 2-Byte RGB Format
Odd bytes Even bytes 8 data bits 2 data bits + 6 unused bits D9D8D7D6D5D4D3D2 0 0 0 0 0 0 D1D0
Figure 25:
Example of Timing for Non-Decimated Uncompressed Output Bypassing Output FIFO
START OF FRAME
PIXCLK FRAME_VALID LINE_VALID DOUT[7:0]
0xFF 0x00 0x00 0xAB 0xFF 0x00 0x00 0x80 Cb0 Y0 Cr0 Y1
END OF FRAME
PIXCLK FRAME_VALID LINE_VALID DOUT[7:0]
Cb0 Y0 Cr0 Y1 0xFF 0x00 0x00 0x9D 0xFF 0x00 0x00 0xB6
FIFO
During normal pipeline operation the output data rate is determined by a number of factors, for instance, input image size, degree of scaling, and sensor operation mode. As these parameters change during normal sensor operation, output frequency changes. This output frequency may generate RF noise, interfering with the mobile device. By using an output FIFO to maintain a constant output clock frequency, noise is easily filtered out. The FIFO accumulates data and after a certain number of bytes are stored, it will yield them in a single burst making sure that data rate within the burst remains constant. This approach may utilize a free running clock thus minimizes possible RF interference. In the default operation the mode user must provide two values for proper FIFO operation: 1. the expected line length (R0x3220) 2. watermark (R0x321E) The value for both has to be specified in bytes. Calculation of line length is straightforward; multiply the number of pixels by the number of bytes per pixel. The number of bytes per pixel is 2 for all output modes except processed Bayer in which it equals one byte per pixel.
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Watermark
Calculation of the watermark should be done based on the maximum number of bytes that the pipeline could output in the given mode (with activated clip and no scaling) and the number of bytes it will yield, taking into account scaling. Also, accounting for the horizontal sensor binning mode if it is activated. In this mode, the number of pixels that the pipeline can output should be doubled.
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w w w . D a t
Camera Control
General Purpose I/Os
The four general purpose I/Os of the MT9D112 can be configured in multiple ways. Each of the I/Os can be used as a simple input/output that can be programmed from the host. The status of the GPIO is read at power up and can be used as a module ID to separate different module suppliers. If 10-bit RAW output is required, GPIO[1:0] can be configured as bit 0 and bit 1 of a 10-bit data bus. GPIO[3:2] can be configured to output a flash pulse to trigger an external Xenon or LED flash or a shutter pulse to control an external shutter. The general purpose inputs are enabled by setting R0x301A[8]. Once enabled, all four inputs must be driven to valid logic levels by external signals. The state of the general purpose inputs can be read through R0x3026[3:0]. In addition, each of the following functions can be associated with none, one, or more of the general purpose inputs so that the function can be directly controlled by a hardware input: * Output enable * Trigger * Standby functions The gpi_status register is used to associate a function with a general purpose input.
Output Enable Control
When the parallel pixel data interface is enabled, its signals can be switched asynchronously between the driven and High-Z under pin or register control, as shown in Table 12. Table 12: Output Enable Control
OE_BAR Pin Disabled Disabled 1 X 0 Drive Signals R0x301A[6] 0 1 0 1 X Description Interface High-Z Interface driven Interface High-Z Interface driven Interface driven
Trigger Control
When the global reset feature is in use, the trigger for the sequence can be initiated either under pin or register control, as shown in Table 13. Table 13: Trigger Control
TRIGGER Disabled Disabled 0 X 1
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Global Trigger R0x3060-1[0] 0 1 0 1 X
Description Idle Trigger Idle Trigger Trigger
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Streaming/Standby Control
The MT9D112 can be switched between its soft standby and streaming states under pin or register control, as shown in Table 14. Table 14: Streaming/STANDBY
STANDBY Disabled Disabled X 0 1 Streaming R0x301A[2] 0 1 0 1 X Description Soft Standby Streaming Soft Standby Streaming Soft Standby
Firmware Architecture
The firmware for the MT9D112 is implemented in multiple drivers that are responsible for different parts of operation. All drivers are executed on the 68HC11 microcontroller from the 32kB ROM and use the 2kB RAM to store variables and firmware updates. The firmware can access registers in the sensor core and the IFP independently from the user through an internal bus. The GPIO interface is accessible through special function registers (SFRs) in memory space. Figure 26: Software Architecture
Operation Driver
Monitor Sequencer Mode Control
Auto Function Driver
Auto Focus
Auto White Balance
Flicker Avoidance
Auto Exposure
Control Driver
AF Mechanics
Hardware
RAM
GPIO
STAT
IFP
Core
Output
Sequencer
The sequencer is responsible for coordinating all events triggered by the user. It is implemented as a state machine. For example, sending a capture command to the sequencer will change the resolution from preview to full resolution, settle the AWB/AE, turn on or off an external LED and switch back to preview after capturing the frame. The setup of the sensor can be defined by the user for the following states: * on entering preview * in preview * when leaving preview * when entering capture
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Context and Operational Modes
The MT9D112 can operate in several modes including preview, still capture (snapshot), and video. All modes of operation are individually configurable and are organized as two contexts-context A and context B. A context is defined by sensor image size, frame rate, resolution and other associated parameters. The user can switch between the two contexts by sending a command via the two-wire serial interface.
Preview Mode
Context A is primarily intended for use in the preview mode. During preview, the sensor usually outputs low resolution images at a relatively high frame rate, and its power consumption is kept to a minimum.
Still Capture and Video Modes
Context B can be configured for the still capture or video mode, as required by the user. For still capture configuration, the user typically specifies the desired output image size, if flash should be enabled, how many frames to capture. For video, the user might select a different image size and a fixed frame rate.
Snapshot and Flash
To take a snapshot, the user must send a command that changes the context from A to B. Typical sequence of events after this command are: * First, the camera may turn on its LED flash, if it has one and is required to use it. With the flash on, the camera exposure and white balance are automatically adjusted to the changed illumination of the scene. * Next, the camera performs auto focusing. Once in focus, it captures one or more frames of desired size. A camera equipped with a xenon flash strobes it during the capture. Completing the sequence, the camera automatically returns to context A and resumes running preview. Note: This sequence of events can take up to 10 frames or more depending on AF hardware capability.
Video
To start video capture, the user must change relevant context B settings, such as capture mode, image size and frame rate, and again send a context change command. Upon receiving it, the MT9D112 switches to the modified context B settings, while continuing to output YUV-encoded image data. Auto exposure and auto focus automatically continues smooth operation. To exit the video capture mode, the user has to send another context change command causing the sensor to be switched back to context A.
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Auto Exposure
The auto exposure algorithm performs automatic adjustments of the image brightness by controlling exposure time and analog gains of the sensor core as well as digital gains applied to the image. Auto exposure is implemented by a firmware driver that analyzes image statistics collected by the exposure measurement engine, makes a decision and programs the sensor core and color pipeline to achieve the desired exposure. The measurement engine subdivides the image into 16 windows organized as a 4 x 4 grid. Two auto exposure algorithm modes are available: 1. preview (luminance-based) 2. evaluative (histogram-based), known as MDR (Maximum Dynamic Range)
Preview Mode
This exposure mode is activated during preview or video capture. It relies on the statistics engine that tracks speed and amplitude of the change of the overall luminance in the selected windows of the image. Backlight compensation is achieved by weighting the luminance in the center of the image higher than the luminance on the periphery. Other algorithm features include the rejection of fast fluctuations in illumination (time averaging), control of speed of response, and control of the sensitivity to small changes. While the default settings are adequate in most situations, the user can program target brightness, measurement window, and other parameters described above. In preview AE, the driver calculates image brightness based on average luma values received from 16 programmable equal-size rectangular windows forming a 4 x 4 grid. In preview mode, 16 windows are combined in 2 segments: central and peripheral. The central segment includes four central windows. All remaining windows belong to the peripheral segment. Scene brightness is calculated as average luma in each segment taken with certain weights. Variable ae.weights[3:0] specifies the central zone weight, ae.weights[7:4] specifies the peripheral zone weight. The driver changes AE parameters (IT, Gains, and so on) to drive brightness (ae.CurrentY) to a programmable target (ae.Target). The magnitude of each single step used to approach the target is defined by the ae.JumpDivisor variable. Expected brightness is: Ynew = ae.CurrentY+(ae.Target-ae.CurrentY)/ ae.JumpDivisor. To avoid unwanted reactions of AE to small fluctuations of scene brightness or momentary scene changes, the AE driver uses a temporal filter for luma and gates around the AE luma target. The driver changes AE parameters only if the buffered luma outsteps AE target gates. Variable ae.lumaBufferSpeed defines the buffering level: 32*Ybuf1 = Ybuf0*(32-ae.lumaBufferSpeed)+Ycurr* ae.lumaBufferSpeed Values ae.lumaBufferSpeed = 32 and ae.JumpDivisor = 1 specify maximal AE speed.
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Evaluative Algorithm (MDR)
A scene-evaluative AE algorithm is available for use in snapshot mode. The algorithm performs scene analysis and classification with respect to its brightness, contrast, and composure and then decides to increase, decrease, or keep the original exposure target. It makes most difference for backlight and bright outdoor conditions.
Accelerated Settling During Overexposure
The AE speed is direction-dependent. Transitioning from over saturation to the target can take more time than transitioning from under-saturation. The AE driver has a mode which speeds up AE for over exposed scenes (ae.status[7]). The AE driver counts the number of AE windows (driver variable ae.numOE) which have average brightness equal to or greater than some value, 250 by default. For a scene having saturated regions, the average luma is underestimated due to signal clipping. The driver compensates underestimation by a factor defined by the ae.numOE variable.
currentY = ae.CurrentY * coeffOE[ae.numOE] / 16; where: const BYTE coeffOE[17] = {16,17, 18, 19, 20, 21, 22, 24, 26, 28, 30, 32, 36, 40, 48, 54, 64};
Exposure Control
To achieve the required amount of exposure, the AE driver adjusts the sensor integration time R0x3012, R0x3018, gains, ADC reference, and IFP digital gains. To reject flicker, integration time is typically adjusted in increments of ae.R9_step. ae.R9_step specifies duration in row times equal to one flicker period. Thus, flicker is rejected if integration time is kept a natural factor of the flicker period. Exposure is adjusted differently depending on illumination situation. * In extremely bright conditions, the exposure is set using R0x3018, R0x3012, and analog gains. * R0x3018 is used to achieve very short integration times. In this situation, * R0x3012=ae.R9_step R0x3012 is set as a natural factor of ae.R9_step. Analog gains are also used, but the green gain, also called virtual gain, does not exceed 2x. ae.minVirtGain limits minimal integration time and is expressed in flicker periods. ae.Index indicates the current integration time expressed in the same form. * Under medium-intensity illumination, the integration time can increase further. For any given exposure, the best signal-to-noise ratio can be typically obtained by using the longest exposure and the smallest gain setting. However, a long exposure time can slow down the output frame rate if the former exceeds the default frame rate, R0x3012 >R0x3006 + R0x300C + 1. Integration ae.IndexTH23 specifies the breakpoint where the AE scheme, giving preference to increasing the shutter width, is replaced with another scheme giving preference to an increase in gain. ae.maxGain23 specifies maximum allowed gain in this situation. ae.VirtGain indicates current green channel gain. * In darker situations, the gain reaches ae.maxGain23 and the integration time is allowed to increase again up to ae.maxIndex.
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* In yet darker situations, once the integration time reaches ae.maxIndex, the analog gain is allowed to increase up to ae.maxVirtGain. * In very dark conditions, the digital IFP gains are allowed to increase up to ae.maxDGainAE1 and ae.maxDGainAE2. ADC is used as an additional gain stage by adjusting reference levels. See Table 33 on page 50 for the ae.ADC* variables. Figure 27: Gain vs. Exposure
ae.maxDGainAE1 / ae.maxDGainAE2
ae.maxVirtGain
ae.maxGain23
....
Increasing Gain
Normally Set To Ensure Constant Frame Rate
2X
Increasing Exposure Time
1X (TH23 + 1) * ae.R9_step (TH23 + 2) * ae.R9_step (TH23 + 3) * ae.R9_step (TH23 + 4) * ae.R9_step ae.indexTH23 2 * ae.R9_step 3 * ae.R9_step 4 * ae.R9_step
...
...
No Gain: Integration Time & Shutter Delay (up to 16 lines)
AE MDR Mode
The MT9D112 also has an AE MDR mode to extend the dynamic range of a scene after AE has settled brightness. This mode can only be selected in PreviewEnter, PreviewLeave, and CaptureEnter states. To set this mode, the following registers must be set: * seq.previewParEnter.ae = 4 * seq.previewParLeave.ae = 4 * seq.capParEnter.ae = 4
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ae.maxIndex
ae.R9_step
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Auto White Balance
The MT9D112 has a built-in auto white balance algorithm designed to compensate for the effects of changing spectra of the scene illumination on the quality of the color rendition. The algorithm consists of two major parts: a measurement engine performing statistical analysis of the image and a driver performing the selection of the optimal color correction matrix, digital, and sensor core analog gains. While default settings of these algorithms are adequate in most situations, the user can reprogram base color correction matrices, place limits on color channel gains, and control the speed of both matrix and gain adjustments. The MT9D112 AWB does not require the presence of gray or white elements in the image for good color rendition. The AWB does not attempt to locate the brightest or grayest element of the image but instead performs statistical image analysis to differentiate between changes in predominant spectra of illumination and changes in predominant colors of the scene. The MT9D112 also includes a module to detect edges based on hue variation which allows high frequency patterns of the same color to be excluded from the AWB calculation.
Flicker Detection
Flicker occurs when the integration time is not an integer multiple of the period of the light intensity. The automatic flicker detection block does not compensate for the flicker, but rather avoids it by detecting the flicker frequency and adjusting the integration time. For integration times below the light intensity period (10ms for 50Hz environments), flicker cannot be avoided. Flicker shows as horizontal bars rolling up or down. The MCU looks for these rolling bars using a thin horizontal window, which outputs luma average and is applied to 48 points in the upper half of the image. The MCU repeats the same sampling on the next frame and subtracts 48 samples from the previous frame from corresponding samples from the current frame. fd.skipFrame allows skipping more frames between subtraction. The MCU then smooths the 48 sampling points, see fd.smooth_cnt, and applies an amplitude threshold fl.minAmplitude to avoid false detection then looks at the resulting waveform. If flicker is present, the waveform should have a frequency within the search range, see fd.search_f1_50, fd.search_f2_50, fd.search_f1_60 and fd.search_f2_60. Assuming the flicker power is a sine wave, subtracting two frames results in sin(wt)-sin(wt+a)=2sin(a/2)cos(wt+a/2) which is a cosine wave of the original frequency.
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Auto Focus
Algorithm
The auto focus algorithm implemented in the MT9D112 firmware seeks to maximize sharpness of vertical lines in images output by the sensor, by guiding an external lens actuator to the position of best lens focus. The algorithm is actuator-independent, providing guidance by means of an abstract 1-dimensional position variable, leaving the translation of its changes into physical lens movements to a separate AF mechanics (AFM) driver. For measuring line sharpness, the AF algorithm relies on the focus measurement engine in the color pipeline, which is a programmable vertical-edge-filtering module. The module convolves two preprogrammed 1-dimensional digital filters with luminance (Y) data it receives row by row from the color interpolation module. In every interpolated image, the pixels whose Y values are used in the convolution form a rectangular block that can be arbitrarily positioned and sized, and in addition divided into up to 16 equalsize sub-blocks, referred to as AF windows or zones. The absolute values of convolution results are summed separately for each filter over each of the AF windows, yielding up to 32 sums per frame. There are several motion sequences through which the MT9D112 AF algorithm can bring a lens to best focus position. All these sequences begin with a jump to a preselected start position, for example, the infinity focus position. This jump is referred to as the first flyback. It is followed by a unidirectional series of steps that puts the lens at up to 19 preselected positions different from the start position. This series of steps is called the first scan. During the scan, the AF algorithm stops the lens at each preselected position long enough to obtain valid sharpness scores. The normalized score for each AF window is stored along with information on how many zones had a high sharpness score and the position with the maximum sharpness score is determined taking into account the zone information. This way the algorithm can handle scenes with objects at different distances. After the first scan the AF algorithm provides a number of ways to proceed with final lens positioning. The user should select a way that best fits the magnitude of lens actuator hysteresis and desired lens proximity to the truly optimal position. Actuators with large, unknown or variable hysteresis should do a second flyback and either jump or retrace the steps of the first scan to the best scanned position. Actuators with constant hysteresis (like stepper motors) can be moved to that position directly from the end position of the scan-the AF algorithm offers an option to automatically increase the length of this move by a preprogrammed backlash-compensating step. Finally, if the first scan is coarse relative to the positioning precision of the lens actuator and depth of field of the lens, an optional second fine scan can be performed around the lens position voted best after the first scan. This second scan is done in the same way as the first, except that the positions it covers are not preselected. Instead, the AF algorithm user must set step size and number of steps for the second scan. The second scan must be followed by the same hysteresis-matching motion sequence as the first scan, for example, a third flyback and jump to the best position. The AF driver is disabled on power-up. If AF is desired, it must be explicitly enabled after every power up or reset before it can be used. This can be accomplished by establishing AF motor type:
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To establish AF motor type: * Set afm.type (0x002) = 129 (for helimorph AF) afm.type (0x002) =130 (for stepper motor AF) afm.type (0x002) =131 (for AD5398) * Turn on AF in preview mode seq.previewPar.af = 1 * Call "refresh" sequencer command seq.cmd = 5
Modes
There are four AF camera modes that the MT9D112 can fully support if it controls the position of the camera lens. 1. Snapshot mode In this mode, a camera performs auto focusing upon a user command to do so. When the auto focusing is finished, a snapshot is normally taken and there is no further AF activity until the next appropriate user command. The MT9D112 can do the auto focusing using its own AF algorithm described above or a substitute algorithm loaded into RAM. It can then wait or automatically proceed with other operations required to take a snapshot. 2. Locked mode The MT9D112 can be commanded to lock the lens in its current position. Between the command to lock the lens and another to release it, the lens does not respond to other commands or scene changes. 3. Focus-free mode In many situations, for example, under low light or during video recording, it may be impossible or undesirable to focus the lens prior to every image capture. Instead, the lens can be locked in a position most likely to produce satisfactory images, for example, the hyperfocal position. This position can be programmed into the MT9D112, and it can move and hold the lens there on command. 4. Manual mode In this mode there is no AF activity-focusing the camera is left to the user. The user typically can move the camera lens in steps, by manually issuing commands to the lens actuator, and observe the effect of his actions on a preview display. The MT9D112 can provide 30 fps image input for the display and simultaneously translate user commands received via two-wire serial interface into digital waveforms driving the lens actuator.
Lens Actuator Interface
Actuators used to move lenses in AF cameras can be classified into several broad categories that differ significantly in their requirements for driving signals. These requirements also vary from one device to another within each category. To ensure its compatibility with many different actuators, the MT9D112 includes a general purpose input/output module (GPIO_AF). The GPIO is a programmable rectangular waveform generator, with 8 individually controllable output pads (GPIO0 through GPIO7), a separate power supply pad (VDD_AF), and a separate clock domain that can be disconnected from the master clock to save power when the GPIO is not in use. The GPIO can toggle its output pads as fast as half the master clock frequency.
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An external host processor or the embedded microcontroller of the MT9D112 have two ways to control the voltages on the GPIO output pads: 1. Setting or clearing bits in a control register The state of the GPIO pads is updated immediately after writing to the register. Since writing via the two-wire serial interface takes some time, this way does not give the host processor a very precise control over GPIO output timing. 2. Waveform programming The second way to obtain a desired output from the GPIO is to program a set of periodic waveforms to the control registers and initialize their generation. The GPIO then generates the programmed waveforms on its own, without waiting for any further input, and therefore with the best attainable timing precision. If necessary, the GPIO can notify the MCU and the host processor about reaching certain points in the waveforms generation, for example, the end of a particular waveform. Every GPIO notification has two components: the GPIO sends a wakeup signal to the MCU and sets a bit in its status register that can be polled by the MCU and/or the host processor. The wakeup signals have an effect only when the MCU is in sleep mode. The MT9D112 can be set up not only to output digital signals to a lens actuator and/or other similar devices, but also to receive their digital feedback. All GPIO output pads are reconfigurable as high-impedance digital inputs. The logical state of each GPIO pad is mirrored by the state of a bit in a dedicated register, which allows the MCU and host processor to sample digital input signals at intervals equal to their respective register read times.
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Two-Wire Serial Interface
The two-wire serial interface bus enables read/write access to control and status registers within the MT9D112.The interface protocol uses a master/slave model in which a master controls one or more slave devices. The sensor acts as a slave device. The master generates a clock (SCLK) that is an input to the MT9D112 and used to synchronize transfers. Data is transferred between the master and the slave on a bidirectional signal (SDATA). SDATA is pulled up to VDD_IO off-chip by a 1.5K resistor. Either the slave or master device can drive SDATA LOW--the interface protocol determines which device is allowed to drive SDATA at any given time.
Protocol
Data transfers on the two-wire serial interface bus are performed by a sequence of lowlevel protocol elements, as follows: * a (repeated) start condition * a slave address/data direction byte * a 16-bit register address * an (a no) acknowledge bit * two data bytes * a stop condition The bus is idle when both SCLK and SDATA are HIGH. Control of the bus is initiated with a start condition, and the bus is released with a stop condition. Only the master can generate the start and stop conditions.
Start Condition
A start condition is defined as a HIGH-to-LOW transition on SDATA while SCLK is HIGH. At the end of a transfer, the master can generate a start condition without previously generating a stop condition, and this is known as a "repeated start" or "restart" condition.
Stop Condition
A stop condition is defined as a LOW -to-HIGH transition on SDATA while SCLK is HIGH.
Data Transfer
Data is transferred serially, 8 bits at a time, with the MSB transmitted first. Each byte of data is followed by an acknowledge bit or a no-acknowledge bit. This data transfer mechanism is used for the slave address/data direction byte and for message bytes. One data bit is transferred during each SCLK clock period. SDATA can change when SCLK is low and must be stable while SCLK is HIGH.
Slave Address/Data Direction Byte
Bits [7:1] of this byte represent the device slave address and bit [0] indicates the data transfer direction. A "0" in bit [0] indicates a write, and a "1" indicates a read. The default slave addresses used by the MT9D112 are 0x78 (write address) and 0x79 (read address). Alternate slave addresses of 0x7A (write address) and 0x7B (read address) can be selected by asserting the SADDR input signal.
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Message Byte
Message bytes are used for sending register addresses and register write data to the slave device and for retrieving register read data. The protocol used is outside the scope of the two-wire serial interface specification.
Acknowledge Bit
Each 8-bit data transfer is followed by an acknowledge bit or a no-acknowledge bit in the SCLK clock period following the data transfer. The transmitter (which is the master when writing, or the slave when reading) releases SDATA. The receiver indicates an acknowledge bit by driving SDATA LOW. As for data transfers, SDATA can change when SCLK is LOW and must be stable while SCLK is HIGH.
No-Acknowledge Bit
The no-acknowledge bit is generated when the receiver does not drive SDATA low during the SCLK clock period following a data transfer. A no-acknowledge bit is used to terminate a read sequence.
Typical Serial Transfer
A typical read or write sequence begins by the master generating a start condition on the bus. After the start condition, the master sends the 8-bit slave address/data direction byte. The last bit indicates whether the request is for a read or a write, where a "0" indicates a write and a "1" indicates a read. If the address matches the address of the slave device, the slave device acknowledges receipt of the address by generating an acknowledge bit on the bus. If the request was a write, the master then transfers the 16-bit register address to which a write should take place. This transfer takes place as two 8-bit sequences and the slave sends an acknowledge bit after each sequence to indicate that the byte has been received. The master then transfers the data as an 8-bit sequence; the slave sends acknowledge bit at the end of the sequence. After 8 bits have been transferred, the slave's internal register address is incremented automatically, so that the next 8 bits are written to the next register address. The master stops writing by generating a (re)start or stop condition. If the request was a read, the master sends the 8-bit write slave address/data direction byte and 16-bit register address, just as in the write request. The master then generates a (re)start condition and the 8-bit read slave address/data direction byte, and clocks out the register data, 8 bits at a time. The master generates an acknowledge bit after each 8bit transfer. The slave's internal register address is auto-incremented after every 8 bits are transferred. The data transfer is stopped when the master sends a no-acknowledge bit.
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Single Read from Random Location
This sequence (Figure 28) starts with a dummy write to the 16-bit address that is to be used for the read. The master terminates the write by generating a restart condition. The master then sends the 8-bit read slave address/data direction byte and clocks out two bytes of register data. The master terminates the read by generating a no-acknowledge bit followed by a stop condition. Figure 28:
SCLK
Single Read from Random Location
SDATA
SLAVE ADDRESS Start ACK ACK ACK Start REG ADDR HIGH REG ADDR LOW SLAVE ADDRESS ACK READ DATA HIGH REG M ACK READ DATA LOW REG M NACK Stop
Single Read from Current Location
This sequence (Figure 29) performs a read using the current value of the MT9D112 internal register address. The master terminates the read by generating a no-acknowledge bit followed by a stop condition. Figure 29: Single Read from Current Location
SCLK
SDATA
SLAVE ADDRESS Start ACK ACK NACK Stop READ DATA HIGH REG M +1 READ DATA LOW REG M +1
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Sequential Read, Start from Random Location
This sequence (Figure 30) starts in the same way as the single read from random location (Figure 28 on page 48). Instead of generating a no-acknowledge bit after the first two bytes of data have been transferred, the master generates an acknowledge bit, and continues to perform byte reads until "L" registers have been read. Figure 30:
SCLK
Sequential Read, Start from Random Location
SDATA
SLAVE ADDRESS Start ACK REG ADDR HIGH ACK REG ADDR LOW ACK Start SLAVE ADDRESS ACK READ DATA HIGH REG M ACK READ DATA LOW REG M
SCLK
SDATA
READ DATA HIGH REG M +1 ACK ACK READ DATA LOW REG M +1
...
READ DATA LOW REG M +L -1 ACK READ DATA HIGH REG M +L ACK READ DATA LOW REG M +L NACK Stop
Sequential Read, Start from Current Location
This sequence (Figure 31 on page 49) starts in the same way as the single read from current location (Figure 29). Instead of generating a no-acknowledge bit after the first two bytes of data have been transferred, the master generates an acknowledge bit, and continues to perform byte reads until "L" registers have been read. Figure 31:
SCLK
Sequential Read, Start from Current Location
SDATA
SLAVE ADDRESS Start ACK ACK READ DATA HIGH REG M +1 READ DATA LOW REG M +1
...
READ DATA LOW REG M +L-1 ACK READ DATA HIGH REG M +L ACK READ DATA LOW REG M +L NACK Stop
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Single Write to Random Location
This sequence (Figure 32) begins with the master generating a start condition. The slave address/data direction byte signals a write and is followed by the high then low bytes of the register address that is to be written. The master follows this with two bytes of write data. The write is terminated by the master generating a stop condition. Figure 32: Single Write to Random Location
SCLK
SDATA
SLAVE ADDRESS Start ACK ACK ACK REG ADDR HIGH REG ADDR LOW WRITE DATA HIGH REG M ACK WRITE DATA LOW REG M ACK Stop
Sequential Write, Start at Random Location
This sequence (Figure 33) starts in the same way as the single write to random location (Figure 32 on page 50). Instead of generating a no-acknowledge bit after two bytes of data have been transferred, the master generates an acknowledge bit, and continues to perform byte writes until "L" registers have been written. The write is terminated by the master generating a stop condition. Figure 33:
SCLK
Sequential Write, Start at Random Location
SDATA
SLAVE ADDRESS Start ACK ACK ACK ACK REG ADDR HIGH REG ADDR LOW WRITE DATA HIGH REG M WRITE DATA LOW REG M
SCLK
SDATA
WRITE DATA HIGH REG M +1 ACK ACK WRITE DATA LOW REG M +1
...
WRITE DATA LOW REG M +L -1 ACK WRITE DATA HIGH REG M +L ACK WRITE DATA LOW REG M +L ACK Stop
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Registers and Variables
Four types of configuration controls are available: 1. Hardware registers 2. Driver variables 3. Special function registers 4. MCU SRAM The following convention is used in the text below to designate registers and variables: R0x3012, R0x3012[3:0] or R12306, R12306[3:0] These refer to two-wire accessible register number 12306. [3:0] indicate bits. Registers numbers range 0..65535 and bits range 15..0. Not all register numbers are used. * ae.Target This refers to variable "Target" in the AE driver. * SFR 0x1080 or SRAM 0x0400 This refers to special function register or SRAM located at address 0x1080 in MCU memory space.
How to Access Registers and Variables
Registers, variables, and SFRs are accessed in different ways.
Registers
Hardware registers are grouped internally by pages. R0x3000 - R0x31FE = Sensor Core Page 0 (sensor controls) R0x3200 - R0x33FE = SoC Page 1 (color pipeline controls) R0X3400 - R0x35BE = SoC Page 2 (color pipeline, MIPI, output FIFO) Not all the registers in each page are used, not all the bits in each register might be used. Registers are accessed by serial interface reads and writes consisting of a 16-bit address and 16-bit data.
Variables
Variables are located in the microcontroller RAM memory. Each driver, such as auto exposure, white balance, and auto focus, has a unique driver ID (0..31) and a set of public variables organized as a structure. Each variable in this structure is uniquely identified by its offset from the top of the structure and its size. The size can be 1 or 2 bytes, while the offset is 1 byte. All driver variables (public and private) can be accessed via R0x338C and R0x3390. While two access modes are available-access by physical address and by logical address, the public variables are typically accessed by the logical method. The logical address, which is set in R0x338C, consists of a 5-bit driver ID number and a variable offset. Examples are provided below. To set the variable ae.Target=50: * The variable has a driver ID of 2. Therefore, set R0x338C[12:8]=2. * The variable has an offset of 6. Therefore, set R0x338C[7:0]=6. * This is a logical access. Therefore, set R0x338C[14:13]=01. * The size of the variable is 8 bits. Therefore, set R0x338C[15]=1.
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* By combining these bits, R0x338C=0xA206. * Set R0x3390=50 for the value of the variable. To read the variable ae.Target: * Since this is the same variable as the above example, R0x338C=0xA206. * Read R0x3390 for the current variable value. To set the variable mon.arg1=0x1234: * The variable has a driver ID of 0. Therefore, set R338C[12:8]=0. * The variable has an offset of 3. Therefore, set R0x3390[7:0]=3. * This is a logical access. Therefore, set R0x338C[14:13]=01. * The size of the variable is 16 bits. Therefore, set R0x338C[15]=0. * By combining these bits, R0x338C=0x2003. * Set R0x3390=0x1234 for the value of the variable. To read the variable mon.arg1: * Since this is the same variable as the above example, R0x338C=0x2003. * Read R0x3390 for the current variable value.
Special Function Registers and MCU SRAM
Special function registers are registers connected to the local bus of the MCU. These registers include GPIO, waveform generator, and those important for firmware operation. Special function registers are accessed by physical address. MCU SRAM consists of 1K system memory and 1K user memory. Examples of access: * Write into user SRAM. Use to upload code a. R0x338C = 0x8400 // address b. R0x3390 = 0x1234 // write 16-bit value * Read from user SRAM c. R0x338C = 0x8400 // address d. Read R0x3390 // read 16-bit value GPIO access example for writing 0x00FE to GPIO R0x1078: * Write to 8-bit GPIO register a. R0x338C = 0x9078 // GPIO direction at 0x1078 b. R0x3390 = 0x00FE // Configure GPIO[0] as output * Read from 8-bit GPIO register c. R0x338C = 0x9078 // GPIO direction at 0x1078 d. Read R0x3390 // Check GPIO[7:0] pad state Note: 8-bit access: R0x338C[15] = 1, R0x338C[14:0] = GPIO register 16-bit access: R0x338C[15] = 0, R0x338C[14:0] = GPIO register
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Core Registers
Double-buffered Registers
Some sensor settings cannot be changed during frame readout. For example, changing x_addr_end R0x3008 part way through frame readout results in inconsistent LINE_VALID behavior. To avoid this, the sensor core double buffers many registers by implementing a pending and a live version. Reads and writes access the pending register. The live register controls the sensor operation. The value in the pending register is transferred to a live register at a fixed point in the frame timing, called frame start. Frame start is defined as the point at which the first dark row is read out. By default, this occurs 10 row times before FRAME_VALID goes HIGH. R0x301A[15] can be used to inhibit transfers from the pending to the live registers. This control should be used when making many register changes that must take effect simultaneously.
Bad Frames
A bad frame is a frame where all rows do not have the same integration time, or where offsets to the pixel values changed during the frame. Many changes to the sensor register settings can cause a bad frame. For example, when x_addr_end R0x3008 is changed, the new register value does not affect sensor behavior until the next frame starts. However, the frame that would be read out at that frame-start has been integrated using the old row width. Consequently, reading it out using the new row width results in a frame with an incorrect integration time. By default, most bad frames are masked: LINE_VALID and FRAME_VALID are inhibited for these frames so that the vertical blanking time between frames is extended by the frame time. This feature can be disabled with R0x301A[10].
Changes to Integration Time
If the integration time is changed while FRAME_VALID is asserted for frame n; the first frame output using the new integration time is frame (n + 2). The sequence is as follows: 1. During frame n, the new integration time is held in the pending register. 2. At the start of frame (n +1), the new integration time is transferred to the live register. Integration for each row of frame (n + 1) has been completed using the old integration time. The earliest time that a row can start integrating using the new integration time is immediately after that row has been read for frame (n + 1). The actual time that rows start integrating using the new integration time is dependent on the new value of the integration time. 3. When frame (n + 2) is read out, it is integrated using the new integration time. If the integration time is changed on successive frames, each value written is applied to a single frame; the latency between writing a value and it affecting the frame readout remains at two frames.
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Changes to Gain Settings
When the gain settings are changed, the gain is usually updated on the next frame start. When the integration time and the gain are changed simultaneously, the gain update is held off by one frame so that the first frame output with the new integration time also has the new gain applied. If the gain and integration time are both changed on successive frames, some gain value is overwritten without being applied, while each integration time is used for one single frame.
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Timing Specifications
Power-up Sequence
Aptina recommends starting the power-up sequence with VDD. Powering down the sensor requires power supplies to be removed in the reverse order. For applications that require complete power down of the MT9D112 when not in use, refer to TN-09-120 for more details on how to perform power removal and application. The sensor includes a power-on reset feature that initiates a reset upon power up. Unless the initial VDD ramp occurs within 5s, it is advised that the user still manually assert a hard reset upon power up. Figure 34: Internal Power-On Reset
< t5
t0 90%
< t0 > t5
< t4
VTRIG_RISING VTRIG_FALLING
> t2
VDD
10% t1 t3 t1
POR Cell Output
Table 15:
Symbol
t0 t1
POR Parameters
Parameter Min - 7 - - - - 1.12 1.0 Typ - 10 0.5 0.5 1 50 - - Max 10 15 1 - - - 1.55 1.45 Unit s s s s s ns V V
VDD ramp time VDD rising, crossing VTRIG_RISING internal reset being released t2 VDD falling, crossing VTRIG_FALLING; internal reset active t3 Minimum VDD spike width below VTRIG_FALLING; considered to be a reset when POR cell output is HIGH t 4 Minimum VDD spike width below VTRIG_FALLING considered to be a reset when POR cell output is LOW t 5 Minimum VDD spike width above VTRIG_RISING considered to be a stable supply when POR cell output is LOW VTRIG_RISING VDD rising trigger voltage VTRIG_FALLING VDD falling trigger voltage Notes:
1. The hard reset and POR signals are gated, therefore, MCU ROM read will begin after both have been deasserted.
The VDD ramp time required are max = 10s. If external VDD ramp is more than 10s, an external reset is required.
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Hard Reset
Figure 35: Hard Reset
t1 t2 t3 t4
EXTCLK
RESET_BAR
SDATA
RESET
ROM Read
Standby/First Serial Write Allowed
Table 16:
Symbol
t1 t2 t3 t4
Hard Reset
Parameter RESET_BAR pulse width Active EXTCLK after RESET_BAR asserted Active EXTCLK before RESET_BAR de-asserted Max ROM read time Min 30 10 10 - Typ - - - - Max - - - 6000 Unit
EXTCLK Cycles
A hard reset sequence to the camera can be activated by the following steps: 1. Wait for all supplies to be stable. 2. Assert RESET_BAR for at least 30 EXTCLK cycles. 3. De-assert RESET_BAR (input clock must be running for at least 10 EXTCLK cycles). 4. Wait 6000 clock cycles before using the two-wire serial interface. After hard reset, the output FIFO is configured for operation but disabled and all outputs are tri-stated.
Soft Reset
A soft reset sequence to the camera can be activated by the following steps: 1. Enable soft reset by setting R0x301A[0]. 2. Wait 6000 clock cycles before using the two-wire serial interface.
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Standby Sequences
Standby mode can be activated by two methods: 1. Assert STANDBY (hard standby.) 2. Issue standby through the two-wire serial interface (soft standby).
Hard Standby
Figure 36: Hard Standby
t1 t2
EXTCLK
STANDBY
STANDBY Asserted
Standby mode
Low Power Standby with EXTCLK Disabled
EXTCLK Enabled
Notes:
1. Standby mode with EXTCLK enabled is allowed, but the lowest power consumption is achieved in standby mode with the EXTCLK disabled.
Table 17:
Symbol
t1 t2
Hard Standby
Parameter Active EXTCLK after STANDBY asserted Active EXTCLK before STANDBY de-asserted Min - 10 Typ 20 - Max 60 - Unit ms EXTCLK cycles
Hard standby can be performed in any sequencer state after all AE, AWB, AF, HG, and flicker calculations are finished and the chip is in sleep mode. During hard standby, the sequencer does the following: * Configures MIPI, PLL, sensor core, and AFM driver * Saves clock control registers * Sets standby done bit * Disables internal clocks * MCU goes into sleep mode After leaving hard standby, the MCU wakes up and performs the following sequence: 1. Restores internal clocks 2. Clears standby done bit 3. Leaves standby for MIPI, PLL, sensor core, and AFM driver To enter hard standby: a. Set STANDBY = 1 The MCU will run standby routine and will set bit R0x3204[0 = 1 when standby entry is completed. By default, the clock is gated off when STANDBY is asserted, therefore the status of R0x3204[0] cannot be polled. During this time, no registers or variables are accessible. b. To ensure standby mode has been entered, wait until the two-wire serial interface becomes non-responsive. c. Optionally, stop the EXTCLK to minimize the standby current.
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To leave hard standby: a. Provide EXTCLK 10 clock cycles before de-asserting STANDBY. b. De-assert STANDBY. c. Set R0x301A[7] = 1 in order to enable parallel output from the sensor. No frames are dropped coming out of standby.
Soft Standby (Two-wire Serial Interface)
Figure 37: Soft Standby
t1 t2
EXTCLK
SDATA
R 0x3202 [0]
Low Power Standby mode with EXTCLK Disabled
Set R0x3202[0] = 1
Poll R0x3204[0]
Standby mode
EXTCLK Enabled
R0x3204[0] = 1
Notes:
1. Standby mode with EXTCLK enabled is allowed, but the lowest power consumption is achieved in standby mode with the EXTCLK disabled.
Table 18:
Symbol
t1 t2
Soft Standby
Parameter Active EXTCLK after R0x3202[0] =1 is set Active EXTCLK before soft standby de-activates Min - 10 Typ 20 - Max 60 - Unit ms EXTCLK cycles
Soft standby can be performed in any sequencer state after all AE, AWB, AF, HG, and flicker calculations are finished and the chip is in sleep mode. During soft standby, the sequencer performs the following functions: 1. Configures MIPI, PLL, sensor core, and AFM driver into perspective standby states 2. Saves clock control registers 3. Sets standby done bit 4. Disables internal clocks 5. MCU goes into sleep mode After leaving soft standby, the MCU wakes up and performs the following functions: 1. Restores internal clocks 2. Clears standby done bit 3. Leaves standby for MIPI, PLL, sensor core, and AFM driver To enter soft standby: a. Set R0x3202[3] = 1 b. Set R0x3202[0] = 1
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c. d.
To ensure Standby mode is entered, poll R0x3204[0] until it equals 1, which indicates that the standby entry is completed. Optionally, stop the EXTCLK to minimize the standby current.
By default, internal clocks are running. To leave soft standby: a. Provide EXTCLK for 10 clock cycles . b. Set R0x3202[0] = 0. c. Set R0x301A[7] = 1. // This will enable parallel output from the sensor. No frames are dropped coming out of standby. Low-Power Standby (VDD_Disable) Low power standby mode uses the SHUTDOWN pin to shut down digital power (VDD_Disable) and ensure the lowest power consumption. All the two-wire serial interface settings and firmware variables including patches will be lost in this mode. Waking up from this mode is equivalent to power up. To enter standby: a. Follow hard standby or soft standby procedure to enter into standby and check for standby entry. b. Pull up the SHUTDOWN pin. To leave standby: a. Pull down SHUTDOWN pin . b. Follow power-up procedure.
How to Inhibit Standby Entry
For both hard and soft standby, standby entry can be inhibited by setting R0x3202[3] = 0.
How to Synchronize Standby with End of Frame
If standby command is issued within a frame, the execution of standby will take place after the completion of the current line by default. In order to synchronize the execution of standby with the end of frame, set R0x3202[1] = 1.
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How to Reproduce the Sequence of Soft Standby in DevWare
To reproduce entering soft standby mode in the demo system with DevWare, proceed with the following sequence: 1. Monitor the standby done status bit (R0x3204[0]), when the bit = 1 the MT9D112 has entered the standby state. 2. Stop the streaming by checking the stop button in DevWare. 3. Set R0x3202[3] = 1 // Enables the use of standby function. 4. Set R0x3202[0] = 1 // Enables standby through two-wire serial interface. 5. Monitor R0x3204[0] // This bit will be set to "1" when the enter standby sequence has been completed. To reproduce leaving soft standby in the demo system with DevWare, proceed with the following sequence: 1. Monitor the standby done status bit (R0x3204[0]), when the bit = 0 the MT9D112 has left the standby state. 2. Set R0x3202[0] = 0 // Disables soft standby. 3. Monitor R0x3204[0] // This bit will be set to "0" when the exit standby sequence has been completed. 4. Set R0x301A[7] = 1 // This will enable parallel output from the sensor. 5. Enable streaming by checking the play button in DevWare. Table 19: Summary of Standby States
Two-wire Serial Interface Standby Trigger to enter standby Set two-wire serial interface register standby two-wire serial interface bit Pin Activated Standby Assert "standby" pin Shutdown Assert "Shutdown" pin. HOST should only assert "Shutdown" pin after host poll standby_done bit asserted or wait certain period of time. De-assert "Shutdown" pin. Internal reset will occur once pin de-asserted. Digital circuit power down.
Trigger for leaving standby Final state of standby
Clear two-wire serial interface register standby two-wire serial interface bit MCU will control the reset of the system to go into standby gracefully (sensor, MIPI, PLL) and update the standby_done bit
De-assert "standby" pin
Time to complete standby
Clocks gated off
MCU will control the reset of the system to go into standby gracefully (sensor, MIPI, PLL), and update standby_done bit. By default the two-wire serial interface will not be responsive in this mode and this fact could be used as a criteria for standby entry completion. 20ms (TYP), 60ms (MAX). Depends on 20ms (typical), 60ms (max). Depends whether sync with end of frame is enabled. on whether sync with end of frame If it is, time varies with frame rate. is enabled. If it is, time varies with frame rate. After reaching the end-point of standby, all After reaching the end-point of internal clocks gate off, except two-wire standby, all internal clocks gate off serial interface decoder. Clocks to gate can by default, including two-wire serial be specified in standby_mode variable interface decoder. Clocks to gate can be specified in standby_mode variable.
Time to enter standby plus Internal VDD discharge time. (in order of ns). All clocks gated off in digital circuit. Input clock pad is powered down.
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Table 19:
Summary of Standby States (continued)
Two-wire Serial Interface Standby Pin Activated Standby Keep Shutdown Lost due to power down. Everything will be reset upon exiting this mode. Soft or Hard Standby complete Digital power down. Analog core in low power mode; MIPI in ultra low power mode; PLL power down lowest power consumption.
Register/SRAM contents Variable contents Pre-state before standby trigger Power consumption
Keep
Any mode
Any mode
If external CLKIN is stopped after reaching Stdcell leakage power is the main the end-point, the power consumption is power consumption. the same as Hard STANDBY. Otherwise, if external CLKIN is left running, the two-wire serial interface decoder is active and will consume power.
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Pin States
Table 20:
Pin DOUT[7:0] PIXCLK LV FV DATA_OUT_N DATA_OUT_P CLK_OUT_N CLK_OUT_P GPIO[3:0]
Pin States During Conditions
Reset Z Z Z Z 0 0 0 0 Z Post-reset Z Z Z Z 0 0 0 0 Z Standby Z by default (configurable via OE_BAR or two-wire serial interface reg) Z by default (configurable) Z by default (configurable) Z by default (configurable) 0 0 0 0 Depending on how system use them as DOUT_LSB1/DOUT_LSB2/SHUTTER/FLASH/ MODULE_ID/TRIGGER/OE_BAR Standby w/ SHUTDOWN Z by default Z by default Z by default Z by default 0 0 0 0 Depending on how system use them as DOUTPSB/SHUTTER/ FLASH/MODULE_ ID/ TRIGGER/OE_BAR Input Input Input I/O (Analog pad) Power Down X X X X X X X X X
AF_GPIO[7:0] SADDR SDATA SCLK ATEST
Z Input Input Input I/O (Analog pad)
Z Input I/O Input I/O (Analog pad)
Will maintain state that was set before Standby Input Input Input I/O (Analog pad)
X
X
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MT9D112: 1/4-Inch 2Mp SOC Digital Image Sensor Spectral Characteristics
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Spectral Characteristics
Figure 38: Chief Ray Angle (CRA 22.1 Deg) vs. Image Height
Image Height CRA vs. Image Height Plot (%) 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 (mm) 0 0.110 0.220 0.330 0.440 0.550 0.660 0.770 0.880 0.990 1.100 1.210 1.320 1.430 1.540 1.650 1.760 1.870 1.980 2.090 2.200 CRA (Deg) 0 2.17 4.28 6.34 8.37 10.34 12.26 14.09 15.80 17.37 18.76 19.95 20.89 21.57 21.98 22.10 21.94 21.53 20.88 20.06 19.14
MT9D112 (CRA = 22.1 Deg)
24 22 20 18 16 14 12 10 8 6 4 2 0 0 10 20 30 40 50 60 70 80 90 100 110 Image Height (%)
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CRA (deg)
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Figure 39:
Chief Ray Angle (27.0 Deg CRA ) vs. Image Height
Image Height CRA vs. Image Height Plot (%) 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 (mm) 0 0.110 0.220 0.330 0.440 0.550 0.660 0.770 0.880 0.990 1.100 1.210 1.320 1.430 1.540 1.650 1.760 1.870 1.980 2.090 2.200 CRA (Deg) 0 2.55 5.09 7.56 10.02 12.42 14.77 16.96 19.10 20.99 22.73 24.07 25.26 25.98 26.57 26.85 27.02 26.99 26.90 26.71 26.42
MT9D112 (CRA = 27.0 Deg) 30 28 26 24 22 20 18
CRA (deg)
16 14 12 10 8 6 4 2 0 0 10 20 30 40 50 60 Image Height (%) 70 80 90 100 110
Figure 40:
Quantum Efficiency
40 Green Blue Red
35
30
Quantum Efficiency (%
25
20
15
10
5
0 350
400
450
500
550
600
650
700
750
Wavelength (nm
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MT9D112: 1/4-Inch 2Mp SOC Digital Image Sensor Electrical Specifications
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Electrical Specifications
Figure 41: I/O Timing Diagram
tR
90%
tF
tEXTCLK
10%
EXTCLK PIXCLK
tPD
tCP1
DOUT[7:0]
XXX
Data
XXX Data
XXX
Data
XXX
Data
XXX
Data
XXX
FRAME_VALID/ LINE_VALID
Note: PLL disabled for tCP.
tPFH tPLH
tPFL tPLL
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MT9D112: 1/4-Inch 2Mp SOC Digital Image Sensor Electrical Specifications
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Table 21:
AC Electrical Characteristics
f
EXTCLK = 6-54 MHz; VDD = 1.8V; VDD_IO = 1.8-2.8V; VAA = 2.8V; VAA_PIX = 2.8V; VDDPLL = 2.8V; T_Junction = 25C; CLOAD = 15-20p Conditions PLL enabled and disabled PLL disabled PLL enabled Min 6 6 40 - - - - 45 - - 0.68 1.60 0.26 0.45 0.40 0.59 0.17 0.21 0.26 0.31 0.12 0.14 - - - - - - Typ - - - 2 - 2 - 50 0.5 - - - - - - - - - - - - - - - - - - 3.5 Max 54 54 80 5 - 5 - 55 - 15 1.90 3.70 0.50 1.40 0.68 0.77 0.26 0.37 0.34 0.37 0.16 0.21 5 5 5 5 5 - Unit MHz MHz MHz ns ns ns ns % ns ns V/ns V/ns V/ns V/ns V/ns V/ns V/ns V/ns V/ns V/ns V/ns V/ns ns ns ns ns ns pF Note
Symbol
f
Parameter External clock frequency PIXCLK/internal master clock frequency Input clock rise time
EXTCLK f PIXCLK
t
R F
From 10 to 90% Vp-p
t
Input clock fall time From 90 to 10% Vp-p Clock duty cycle Input clock jitter (peak-peak cycle jitter) EXTCLK rising to PIXCLK falling propagation delay
3 4 3 4 1
tJITTER tCP
PLL disabled C_LOAD = 30 3pF C_LOAD = 15 3pF C_LOAD = 30 3pF C_LOAD = 15 3pF CLOAD = 30 3pF CLOAD = 15 3pF CLOAD = 30 3pF CLOAD = 15 3pF CLOAD = 30 3pF CLOAD = 15 3pF CLOAD = 30 3pF CLOAD = 15 3pF
Output pin slew Programmable slew = 7 Output pin slew Programmable slew = 4
VDD_IO = 2.8V VDD_IO = 1.8V VDD_IO = 2.8V VDD_IO = 1.8V VDD_IO = 2.8V
Programmable slew = 0 VDD_IO = 1.8V
tPD t
PFH tPLH tPFL t PLL CIN
PIXCLK to data valid PIXCLK to FV HIGH PIXCLK to LV HIGH PIXCLK to FV LOW PIXCLK to LV LOW Input pin capacitance Notes:
Default Default Default Default Default
2 2 2 2 2
1. Value equal to jitter on tester. 2. Valid for C_LOAD <20pF on PIXCLK, DOUT, LINE_VALID, and FRAME_VALID pads. Loads must be matched as closely as possible. 3. PLL is off. 4. When PLL is on, the input clock rise/fall time specificatons are not applicable; the input HIGH/LOW voltage should still meet the specifications included in Table 22 on page 67.
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Table 22:
Symbol VIH VIL IIN VOH VOL IOH IOL IOZ
I/O Parameters
Parameter Input HIGH voltage Input LOW voltage Input leakage current Output HIGH voltage Output LOW voltage Output HIGH current Output HIGH current Tri-state output leakage current Condition VDD_IO = 2.8V at specified IIN VDD_IO = 1.8V at specified IIN VDD_IO = 2.8V at specified IIN VDD_IO = 1.8V at specified IIN No pull-up resistor; VIN = VDD or DGND At specified IOH At specified IOL At specified VOH At specified VOL VIN = VDD_IO or GND Min 2.4 1.4 GND -0.3 GND -0.3 -50 VDD_IO -0.4 - - - -10 Typ Max VDD_IO + 0.3 VDD_IO + 0.3 0.8 0.4 50 0.4 -7 7 10 Unit V V ?A V V mA mA A
- - - - - -
Table 23:
DC Electrical Definitions and Characteristics
fEXTCLK = 6-54 MHz; VDD = 1.8V; VDD_IO = 2.8V; VAA = 2.8V; VAA_PIX = 2.8V; VDDPLL = 2.8V;
T_Junction = 25C; Dark lighting conditions Symbol VDD VDD_IO Parameter Core digital voltage I/O digital voltage Conditions Serial data interface Parallel data interface Min 1.7 1.7 2.5 1.7 2.5 2.5 2.5 1.7 2.5 - - - - - - - - - - - - - - - - - - - - Typ 1.8 1.8 2.8 1.8 2.8 2.8 2.8 1.8 2.8 16 25 25 - - - - - 22 38 37 - - - - - 1 1 35 35 Max 1.95 1.95 3.1 1.95 3.1 3.1 3.1 1.95 3.1 23 28 - 24 1.25 10 140 150 33 42 - 40 0.75 10 202 218 5 5 100 100 Unit V V V V V V V V V mA mA mA mA mA mA mW mW mA mA mA mA mA mA mW mW A A A A Note
VAA VAA_PIX VDDPLL VDD_AF IDD_1 IDD_IO_1 IAA_1 IAA_PIX_1 IDD_PLL_1
Analog voltage Pixel supply voltage PLL supply voltage AF supply voltage Digital operating current I/O digital supply current Analog operating current Pixel supply current PLL supply current Total power consumption Low power preview See note 2 Low power preview Low power preview Low power preview with PLL enabled Low power preview Full resolution See note 3 Full resolution Full resolution Full resolution with PLL enabled Full resolution PLL off PLL on
2
IDD_2 IDD_IO_2 IAA_2 IAA_PIX_2 IDD_PLL_2
Digital operating current I/O digital supply current Analog operating current Pixel supply current PLL supply current Total power consumption Standby current 1 Standby current 2 Standby current 3 Standby current 4
PLL off PLL on PLL off PLL on
1 1
3
STDBY_1 STDBY_2 STDBY_3 STDBY_4
PLL off PLL on Hard standby with SHUTDOWN enabled Soft standby with SHUTDOWN enabled Soft standby with EXTCLK disabled Hard standby with EXTCLK disabled
1 1 4 4
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MT9D112: 1/4-Inch 2Mp SOC Digital Image Sensor Electrical Specifications
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Notes: 1. 2. 3. 4. Total power consumption does not include current from VDD_IO or VDD_AF. High power preview mode with 29 fps at illuminated flat field target. Full resolution mode with 15 fps at illuminated flat field target. EXTCLK does not effect current consumption when SHUTDOWN is enabled.
Caution Stresses above those listed in Table 24 may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 24: Absolute Maximum Ratings
Rating Symbol VDD_MAX VDD_IO_MAX VAA_MAX VAA_PIX_MAX VDD_PLL MAX VIN IIN T_OP T_STG1 Parameter Core digital voltage I/O digital voltage Analog voltage Pixel supply voltage PLL supply voltage DC input voltage Transient input current (0.5 sec duration) Operating temperature (measure at junction) Storage temperature Notes: Min -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 - -30 -40 Max 2.4 4.0 4.0 4.0 4.0 VDD_IO + 0.3 150 75 85 Unit V V V V V V mA C
C
1. This is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in the product specification is not implied.
Figure 42:
Two-Wire Serial Interface Timing
t
IC
t
t
ICL
ICH
SCLK
t
ISS
t
ISD
t
IHD
t
ISP
SDATA
(Input to sensor)
t
OAA
t
ODA
SDATA (Output to sensor)
Figure 43: Two-Wire Serial Interface Start and Stop Timing
SCLK
t
IHS
t
IHP
SDATA (input to sensor)
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Table 25:
Symbol
f
Two-Wire Serial Interface Timing Specifications
VDD = 1.8V; VAA = 2.8V; VAA_PIX = 2.8V; VDD_IO = 1.8-2.8V; TJ = 30C + 70C, unless otherwise specified Parameter Serial interface input clock frequency SCLK duty cycle Setup time for start condition Hold time for start condition Hold time for input data Setup time for input data Setup time for stop condition Hold time for stop condition Output data acknowledge time Output data delay time Min 0 35 820 660 10 300 300 300 - 550 1200 - - - Typ 100 - - - - - - - - - - 1.5 Max 400 65 - - - - - - 350 1200 - 6 15 - Unit kHz % ns ns ns ns ns ns ns ns pF pF K Note
SCLK
t t
ISS IHS t IHD t ISD t ISP t IHP t OAA
tODA
1 2 1 2
Serial interface input pin capacitance C_IN_SI C_LOAD_SD SDATA max load capacitance R_SD SDATA pull-up resistor Notes: 1. Master clock frequency of 50 MHz. 2. Master clock frequency of 6 MHz.
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MT9D112: 1/4-Inch 2Mp SOC Digital Image Sensor Revision History
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Revision History
Rev. J. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5/25/10 * Updated to non-confidential Rev. H . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3/10/10 * Updated to Aptina template * Register tables moved to new document, the MT9D112 Register Reference Rev. G, Production . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1/14/08 * Added new part number to Table 2 on page 1 * Added more detail to "Special Function Registers and MCU SRAM" on page 52 * Added Figure 39: "Chief Ray Angle (27.0 Deg CRA ) vs. Image Height," on page 64 * Updated Figure 40: "Quantum Efficiency," on page 64 with thicker lines Rev. F, Production . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5/24/07 * Added reference to TN-09-120 in "Power-up Sequence" on page 55 * Updated Table 41, "I/O Timing Diagram," on page 65 * Updated Figure 35: "Hard Reset," on page 56 * Updated Figure 36: "Hard Standby," on page 57 * Updated Figure 37: "Soft Standby," on page 58 * Reworded "Standby Sequences" on page 57 through page 60 * Updated Table 21, "AC Electrical Characteristics," on page 66 * Updated Figure 41: "I/O Timing Diagram," on page 65 * Updated Figure 42: "Two-Wire Serial Interface Timing," on page 68 * Updated Figure 43: "Two-Wire Serial Interface Start and Stop Timing," on page 68 * Updated Table 25, "Two-Wire Serial Interface Timing Specifications," on page 69 * Fixed minor typos throughout the document Rev. E, Production. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11/06 * Updated Table 1, "Key Performance Parameters," on page 1 * Updated "MT9D112 Overview" on page 7 * Updated Table 3, "Signal Description," on page 9 * Updated "Architecture Overview" on page 11 * Updated "Sensor Core Description" on page 11 * Updated "Integration Time" on page 14 * Updated "Raw Data Timing" on page 22 * Updated Figure 25: "Example of Timing for Non-Decimated Uncompressed Output Bypassing Output FIFO," on page 34 * Updated "Single Read from Random Location" on page 48 * Updated Figure 28: "Single Read from Random Location," on page 48 * Updated "Single Read from Current Location" on page 48 * Updated "Sequential Read, Start from Random Location" on page 49 * Updated "Sequential Read, Start from Current Location" on page 49 * Updated Figure 29: "Single Read from Current Location," on page 48 * Updated Figure 30: "Sequential Read, Start from Random Location," on page 49 * Updated Figure 31: "Sequential Read, Start from Current Location," on page 49 * Updated Figure 32: "Single Write to Random Location," on page 50 * Updated "Single Write to Random Location" on page 50
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* * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
Updated "Sequential Write, Start at Random Location" on page 50 Updated Figure 33: "Sequential Write, Start at Random Location," on page 50 Updated Table 15, "0: Core Registers," on page 1 Updated Table 16, "1: SOC1 Registers," on page 5 Updated Table 17, "2: SOC2 Registers," on page 8 Updated Table 18, "0: Monitor Variables," on page 12 Updated Table 19, "1: Sequencer Variables," on page 12 Updated Table 20, "2: Auto Exposure Variables," on page 14 Updated Table 21, "3: Auto White Balance Variables," on page 16 Updated Table 22, "4: Anti-Flicker Variables," on page 18 Updated Table 23, "5: Auto Focus Variables," on page 20 Updated Table 24, "6: Auto Focus Mechanism Variables," on page 21 Updated Table 25, "7: Mode Variables," on page 22 Updated Table 26, "11: Histogram Variables," on page 25 Updated Table 27, "0: GPIO Registers," on page 25 Updated Table 28, "0: Core Registers," on page 1 Updated Table 29, "1: SOC1 Registers," on page 11 Updated Table 30, "2: SOC Registers," on page 25 Updated Table 31, "0: Monitor Variables," on page 41 Updated Table 32, "1: Sequencer Variables," on page 42 Updated Table 33, "2: Auto Exposure Variables," on page 50 Updated Table 34, "3: Auto White Balance Variables," on page 54 Updated Table 35, "4: Anti-Flicker Variables," on page 59 Updated Table 36, "5: Auto Focus Variables," on page 62 Updated Table 37, "6: Auto Focus Mechanism Variables," on page 66 Updated Table 38, "7: Mode Variables," on page 71 Updated Table 39, "11: Histogram Variables," on page 82 Updated Table 40, "0: GPIO Registers," on page 83 Updated "Power-up Sequence" on page 55 Updated Table 16, "Hard Reset," on page 56 Updated Figure 35: "Hard Reset," on page 56 Updated Table 17, "Hard Standby," on page 57 Updated "Hard Standby" on page 57 Updated "Soft Standby (Two-wire Serial Interface)" on page 58 Updated Table 18, "Soft Standby," on page 58 Updated "How to Synchronize Standby with End of Frame" on page 59 Updated Table 19, "Summary of Standby States," on page 60 Updated Figure 41: "I/O Timing Diagram," on page 65 Updated Table 23, "DC Electrical Definitions and Characteristics," on page 67 Updated Table 24, "Absolute Maximum Ratings," on page 68 Updated Table 25, "Two-Wire Serial Interface Timing Specifications," on page 69
Rev. D, Production . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8/06 * Updated Table 1, "Key Performance Parameters," on page 1 * Updated Table 6, "Row Timing Parameters," on page 23 * Updated Figure 28: "Single Read from Random Location," on page 48 * Updated Figure 30: "Sequential Read, Start from Random Location," on page 49 * Updated"Power-up Sequence" on page 55 * Updated Figure 41: "I/O Timing Diagram," on page 65
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* * * * *
Updated Table 21, "AC Electrical Characteristics," on page 66 Updated Table 22, "I/O Parameters," on page 67 Updated Table 23, "DC Electrical Definitions and Characteristics," on page 67 Updated Figure 42: "Two-Wire Serial Interface Timing," on page 68 Updated Table 25, "Two-Wire Serial Interface Timing Specifications," on page 69
Rev. C, Preliminary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5/06 * Updated "Features" on page 1 * Updated Table 3, "Signal Description," on page 9 * Updated Figure 1: "Typical Configuration (connections)," on page 10 * Updated "Gain Options" on page 14 * Updated "Integration Time" on page 14 * Updated "Pixel Array" on page 12 * Updated Figure 7: "6 Pixels in Normal and Column Mirror Readout Modes," on page 17 * Updated Figure 8: "6 Rows in Normal and Row Mirror Readout Modes," on page 17 * Updated "Lens Shading Correction" on page 26 * Updated "Contrast and Gamma Correction" on page 28 * Updated Figure 25: "Example of Timing for Non-Decimated Uncompressed Output Bypassing Output FIFO," on page 34 * Updated "General Purpose I/Os" on page 36 * Updated "Snapshot and Flash" on page 38 * Updated "Exposure Control" on page 40 * Updated "Slave Address/Data Direction Byte" on page 46 * Updated Figure 30: "Sequential Read, Start from Random Location," on page 49 * Updated Figure 33: "Sequential Write, Start at Random Location," on page 50 * Updated Table 15, "0: Core Registers," on page 1 * Updated Table 16, "1: SOC1 Registers," on page 5 * Updated Table 17, "2: SOC2 Registers," on page 8 * Updated Table 18, "0: Monitor Variables," on page 12 * Updated Table 19, "1: Sequencer Variables," on page 12 * Updated Table 20, "2: Auto Exposure Variables," on page 14 * Updated Table 21, "3: Auto White Balance Variables," on page 16 * Updated Table 22, "4: Anti-Flicker Variables," on page 18 * Updated Table 23, "5: Auto Focus Variables," on page 20 * Updated Table 24, "6: Auto Focus Mechanism Variables," on page 21 * Updated Table 25, "7: Mode Variables," on page 22 * Updated Table 26, "11: Histogram Variables," on page 25 * Updated Table 27, "0: GPIO Registers," on page 25 * Updated Table 28, "0: Core Registers," on page 1 * Updated Table 29, "1: SOC1 Registers," on page 11 * Updated Table 30, "2: SOC Registers," on page 25 * Updated Table 31, "0: Monitor Variables," on page 41 * Updated Table 32, "1: Sequencer Variables," on page 42 * Updated Table 33, "2: Auto Exposure Variables," on page 50 * Updated Table 34, "3: Auto White Balance Variables," on page 54 * Updated Table 35, "4: Anti-Flicker Variables," on page 59 * Updated Table 36, "5: Auto Focus Variables," on page 62 * Updated Table 37, "6: Auto Focus Mechanism Variables," on page 66
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* * * * * * *
Updated Table 38, "7: Mode Variables," on page 71 Updated Table 39, "11: Histogram Variables," on page 82 Updated Table 40, "0: GPIO Registers," on page 83 Updated "Power-up Sequence" on page 55 Added "Pin States" on page 62 Updated Table 20, "Pin States During Conditions," on page 62 Added Figure 40: "Quantum Efficiency," on page 64
Rev. B, Preliminary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2/06 * Updated "Features" on page 1 * Updated Table 1, "Key Performance Parameters," on page 1 * Updated "General Description" on page 7 * Updated "MT9D112 Overview" on page 7 * Updated Table 3, "Signal Description," on page 9 * Updated Figure 1: "Typical Configuration (connections)," on page 10 * Updated "Sensor Core Description" on page 11 * Updated "Pixel Array" on page 12 * Updated Figure 4: "Pixel Array," on page 12 * Updated Figure 5: "Pixel Color Pattern Detail (Top Right Corner)," on page 13 * Updated "Default Readout Order" on page 13 * Updated "Integration Time" on page 14 * Updated "PLL Setup" on page 15 * Updated "Horizontal Mirror" on page 16 * Updated Table 4, "Frequency Parameters," on page 16 * Updated "Window Size" on page 16 * Updated "Raw Data Timing" on page 22 * Updated Table 6, "Row Timing Parameters," on page 23 * Updated Figure 20: "Test Patterns," on page 25 * Updated "Test Patterns" on page 25 * Updated "First Black Level Subtraction and Digital Gain" on page 26 * Updated "Contrast and Gamma Correction" on page 28 * Updated "Color Kill" on page 30 * Updated "Parallel and MIPI Output" on page 32 * Updated "YUV/RGB Uncompressed Output" on page 32 * Updated "Uncompressed 10-Bit Bypass Output" on page 34 * Updated "Firmware Architecture" on page 37 * Updated "Slave Address/Data Direction Byte" on page 46 * Updated "Message Byte" on page 47 * Updated "Protocol" on page 46 * Updated "Data Transfer" on page 46 * Updated "Typical Serial Transfer" on page 47 * Updated Figure 28: "Single Read from Random Location," on page 48 * Updated Figure 29: "Single Read from Current Location," on page 48 * Updated Figure 30: "Sequential Read, Start from Random Location," on page 49 * Updated Figure 31: "Sequential Read, Start from Current Location," on page 49 * Updated "Registers" on page 51 * Updated "Variables" on page 51 * Updated "Double-buffered Registers" on page 53 * Updated "Bad Frames" on page 53
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* * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
Updated "Changes to Integration Time" on page 53 Updated "Changes to Gain Settings" on page 54 Updated Table 15, "0: Core Registers," on page 1 Updated Table 16, "1: SOC1 Registers," on page 5 Updated Table 17, "2: SOC2 Registers," on page 8 Updated Table 18, "0: Monitor Variables," on page 12 Updated Table 19, "1: Sequencer Variables," on page 12 Updated Table 20, "2: Auto Exposure Variables," on page 14 Updated Table 21, "3: Auto White Balance Variables," on page 16 Updated Table 22, "4: Anti-Flicker Variables," on page 18 Updated Table 23, "5: Auto Focus Variables," on page 20 Updated Table 24, "6: Auto Focus Mechanism Variables," on page 21 Updated Table 25, "7: Mode Variables," on page 22 Updated Table 26, "11: Histogram Variables," on page 25 Updated Table 27, "0: GPIO Registers," on page 25 Updated Table 28, "0: Core Registers," on page 1 Updated Table 29, "1: SOC1 Registers," on page 11 Updated Table 30, "2: SOC Registers," on page 25 Updated Table 31, "0: Monitor Variables," on page 41 Updated Table 32, "1: Sequencer Variables," on page 42 Updated Table 33, "2: Auto Exposure Variables," on page 50 Updated Table 34, "3: Auto White Balance Variables," on page 54 Updated Table 35, "4: Anti-Flicker Variables," on page 59 Updated Table 36, "5: Auto Focus Variables," on page 62 Updated Table 37, "6: Auto Focus Mechanism Variables," on page 66 Updated Table 38, "7: Mode Variables," on page 71 Updated Table 39, "11: Histogram Variables," on page 82 Updated Table 40, "0: GPIO Registers," on page 83 Updated "Power-up Sequence" on page 55 Updated "Hard Reset" on page 56 Updated "Standby Sequences" on page 57 Updated "Soft Reset" on page 56 Updated "Hard Standby" on page 57 Updated "Soft Standby (Two-wire Serial Interface)" on page 58 Updated Figure 36: "Hard Standby," on page 57 Updated Table 17: "Hard Standby," on page 57 Updated Figure 37: "Soft Standby," on page 58 Updated "Low-Power Standby (Vdd_Disable)" on page 59 Updated Table 20, "Pin States During Conditions," on page 62 Updated Figure 38: "Chief Ray Angle (CRA 22.1 Deg) vs. Image Height," on page 63 Updated Figure 41: "I/O Timing Diagram," on page 65 Updated Table 21, "AC Electrical Characteristics," on page 66 Updated Table 22, "I/O Parameters," on page 67 Updated Table 23, "DC Electrical Definitions and Characteristics," on page 67 Updated Table 24, "Absolute Maximum Ratings," on page 68 Updated Table 15, "POR Parameters," on page 55 Updated Table 25, "Two-Wire Serial Interface Timing Specifications," on page 69
PDF: 2042175286/Source: 6345780379 MT9D112_DS - Rev. L 5/10 EN
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Aptina reserves the right to change products or specifications without notice. (c)2005 Aptina Imaging Corporation. All rights reserved.
MT9D112: 1/4-Inch 2Mp SOC Digital Image Sensor Revision History
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Rev, A, Advance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10/05 * Initial release
10 Eunos Road 8 13-40, Singapore Post Center, Singapore 408600 prodmktg@aptina.com www.aptina.com Aptina, Aptina Imaging, DigitalClarity, and the Aptina logo are the property of Aptina Imaging Corporation All other trademarks are the property of their respective owners. This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein. Although considered final, these specifications are subject to change, as further product development and data characterization sometimes occur.
PDF: 2042175286/Source: 6345780379 MT9D112_DS - Rev. L 5/10 EN
75
Aptina reserves the right to change products or specifications without notice. (c)2005 Aptina Imaging Corporation All rights reserved.


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